PCA9632DP1-T NXP Semiconductors, PCA9632DP1-T Datasheet - Page 34

• Manufacturer Part Number: PCA9632DP1-T
• Description: LED Drivers 4-BIT FM+I2C-BUS LOW POWER LED
• Manufacturer: NXP Semiconductors

Specifications of PCA9632DP1-T

• Number Of Segments: 4
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Package Type: TSSOP
• Pin Count: 8
• Mounting: Surface Mount
• Power Dissipation: 400mW
• Operating Supply Voltage (min): 2.3V
• Operating Supply Voltage (max): 5.5V
• Low Level Output Current: 100000 uA
• Operating Supply Voltage: 2.3 V to 5.5 V
• Maximum Supply Current: 150 uA
• Maximum Power Dissipation: 400 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: TSSOP-8
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Compliant
• Other names: PCA9632DP1,118

NXP Semiconductors
PCA9632_3
Product data sheet
17.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 20.
Table 21.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
•
•
2.5
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 20
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
21
29.
Rev. 03 — 15 July 2008
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
4-bit Fm+ I
350 to 2000
260
250
245
29) than a SnPb process, thus
2
220
220
C-bus low power LED driver
350
> 2000
260
245
245
PCA9632
© NXP B.V. 2008. All rights reserved.
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