A80960HD80S L2GK Intel, A80960HD80S L2GK Datasheet - Page 33

• Manufacturer Part Number: A80960HD80S L2GK
• Manufacturer: Intel

Specifications of A80960HD80S L2GK

• Family Name: i960
• Device Core Size: 32b
• Frequency (max): 80MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 3.3V
• Operating Supply Voltage (max): 3.45V
• Operating Supply Voltage (min): 3.15V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Through Hole
• Pin Count: 168
• Package Type: CPGA
• Lead Free Status / RoHS Status: Compliant

Datasheet
Table 14. Maximum T
Table 15. 80960Hx 208-Pin PQ4 Package Thermal Characteristics
Core
1X Bus
Clock
Core
2X Bus
Clock
Core
3X Bus
Clock
† 0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).
(Case measured as
shown in
(No Heatsink)
(With Heatsink)
NOTES:
1. This table applies to 80960Hx PQ4 plugged into socket or soldered directly to board.
2.
3. 0.285” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 150 mil center-to-center fin spacing).
Junction-to-Case
Case-to-Ambient
Case-to-Ambient
JA
Parameter
=
Figure
JC
T
Heatsink
T
without
Heatsink
T
Heatsink
T
without
Heatsink
T
Heatsink
T
without
Heatsink
+
A
A
A
A
A
A
A
3
with
with
with
at Various Airflows in °C (PQ4 Package Only)
CA
5.)
†
†
†
Thermal Resistance — °C/Watt
(0)
12
11
f
(MHz)
0
1
CLKIN
25
33
40
25
33
40
16
25
33
40
16
25
33
40
20
25
20
25
(1.01)
200
10
1
7
Airflow — ft./min (m/sec)
(0)
71
67
63
70
65
61
71
62
55
48
69
60
52
42
58
51
56
48
0
(2.03)
400
1
8
5
(3.07)
(1.01)
600
200
76
74
71
73
68
65
76
71
66
62
72
64
57
51
68
64
61
55
1
8
5
(4.06)
800
Airflow-ft/min (m/sec)
1
7
4
(2.03)
400
79
77
75
75
72
69
79
75
71
68
75
68
63
58
73
70
66
61
(5.07)
1000
1
7
4
(3.04)
600
79
77
75
75
72
69
79
75
71
68
75
68
63
58
73
70
66
61
JA
80960HA/HD/HT
(4.06)
800
80
79
77
76
74
71
80
77
74
72
76
71
66
62
76
73
68
64
JC
(5.07)
1000
80
79
77
76
74
71
80
77
74
72
76
71
66
62
76
73
68
64
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