STM32F217ZGT6 STMicroelectronics, STM32F217ZGT6 Datasheet - Page 109

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STM32F217ZGT6

Manufacturer Part Number
STM32F217ZGT6
Description
MCU ARM 1024KB FLASH 144LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheets

Specifications of STM32F217ZGT6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
120MHz
Connectivity
CAN, Ethernet, I²C, IrDA, LIN, MMC, SPI, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
114
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
132K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 24x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Cpu Family
STM32
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
120MHz
Total Internal Ram Size
132KB
# I/os (max)
114
Number Of Timers - General Purpose
14
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.8V
On-chip Dac
2(2-chx12-bit)
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
144
Package Type
LQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-11189

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STM32F215xx, STM32F217xx
Table 61.
1. TBD stands for “to be defined”.
2. It is recommended to maintain the voltage difference between V
3. Based on characterization, not tested in production.
4. V
5. R
6. For external triggers, a delay of 1/f
I
I
VREF+
DDA
Symbol
f
S
REF+
ADC
(3)
(3)
(3)
maximum value is given for V
is internally connected to V
Sampling rate
(f
ADC V
consumption in conversion mode
ADC VDDA DC current
consumption in conversion mode
ADC
ADC characteristics
Equation 1: R
The formula above
allowed for an error below 1/4 of LSB. N = 12 (from 12-bit resolution) and k is the number of
sampling periods defined in the ADC_SMPR1 register.
= 30 MHz)
REF
DC current
Parameter
AIN
DDA
PCLK2
max formula
DD
(Equation
=1.8 V, and minimum value for V
and V
(1)
must be added to the latency specified in
(continued)
REF-
R
AIN
is internally connected to V
1) is used to determine the maximum external impedance
Doc ID 17050 Rev 4
Interleave Triple ADC
Interleave Dual ADC
=
480 sampling time
480 sampling time
12-bit resolution
12-bit resolution
12-bit resolution
12-bit resolution
12-bit resolution
12-bit resolution
12-bit resolution
3 sampling time
3 sampling time
f
f
f
f
ADC
ADC
ADC
ADC
------------------------------------------------------------- - R
f
Single ADC
Conditions
ADC
mode
mode
= 30 MHz
= 30 MHz
= 30 MHz
= 30 MHz
×
C
(
REF+
k 0.5
ADC
and V
×
DD
ln
=3.3 V.
)
DDA
(
SSA
2
N
below 1.8 V.
.
+
2
Table
Min
)
-
-
-
-
-
-
-
61.
ADC
Electrical characteristics
Typ
300
1.6
-
-
-
-
-
TBD
TBD
Max
500
1.8
2
4
6
109/158
Msps
Msps
Msps
Unit
mA
µA
µA

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