DAC1003D160HW/C1,5 NXP Semiconductors, DAC1003D160HW/C1,5 Datasheet
DAC1003D160HW/C1,5
Specifications of DAC1003D160HW/C1,5
DAC1003D160HW/C1-T
DAC1003D160HW/C1-T
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DAC1003D160HW/C1,5 Summary of contents
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DAC1003D160 Dual 10 bits DAC 160 MHz interpolation Rev. 02 — 13 August 2008 1. General description The DAC1003D160 is optimized to reduce architecture complexity and overall system cost. The Digital-to-Analog Converter (DAC) leads dynamic performance ...
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... NXP Semiconductors 4. Ordering information Table 1. Ordering information Type number Package Name DAC1003D160HW HTQFP80 5. Block diagram (1) Pins 1, 3, 61, 65, 76 and 80. (2) Pins 4, 7, 62, 64, 66, 67, 70, 71, 74, 75, 77 and 79. (3) Pins 9, 17, 25, 29, 30, 35, 44, 49, 50, 52, 53, 54, 55 and 56. (4) Pins 18, 26, 36, 43, 63 and 78. ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning V CCA V CCA AGND CLK CLKN AGND DGND V CCD DGND DEC Fig 2. Pin configuration 6.2 Pin description Table 2. Symbol V CCA i.c. V CCA AGND CLK CLKN AGND i.c. DGND DAC1003D160_2 Product data sheet Dual 10 bits DAC 160 MHz interpolation ...
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... NXP Semiconductors Table 2. Symbol V CCD DGND DEC n.c. n.c. DGND DEC n.c. n.c. DGND DGND DGND DEC DEC DGND n.c. n.c. n.c. n.c. DGND DGND DAC1003D160_2 Product data sheet Dual 10 bits DAC 160 MHz interpolation Pin description …continued [1] Pin Type Description ...
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... NXP Semiconductors Table 2. Symbol V CCD DGND DGND DGND DGND DGND GAPD GAPOUT QVIRES IVIRES V CCA AGND DEC AGND V CCA AGND AGND QOUTN QOUT AGND AGND IOUTN IOUT AGND AGND V CCA AGND DEC AGND V CCA [1] Type description: S: Supply; G: Ground; I: Input; O: Output. DAC1003D160_2 ...
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... NXP Semiconductors 7. Functional description The DAC1003D160 is a segmented architecture composed of a 7-bit thermometer sub-DAC and the remaining 3-bit in a binary weighted sub-DAC. The device produces two complementary current outputs on both channels, respectively pins IOUT/IOUTN and QOUT/QOUTN which need to be connected via a load resistor to the ground ...
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... NXP Semiconductors 8. Limiting values Table 3. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CCD V CCA stg T amb T j [1] All supplies are connected together. 9. Thermal characteristics Table 4. Symbol R th(j-a) R th(c-a) 10. Characteristics Table 5. Characteristics 3 3.6 V; AGND and DGND connected together; T ...
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... NXP Semiconductors Table 5. Characteristics …continued 3 3.6 V; AGND and DGND connected together; T CCD CCA 3 and T CCD CCA O(fs) Figure 10; unless otherwise specified. Symbol Parameter I analog supply current CCA P total power dissipation tot Clock inputs (CLK and CLKN) V common-mode input I(cm) voltage ...
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... NXP Semiconductors Table 5. Characteristics …continued 3 3.6 V; AGND and DGND connected together; T CCD CCA 3 and T CCD CCA O(fs) Figure 10; unless otherwise specified. Symbol Parameter I output noise current n(o) E offset error offset E gain error gain mismatch IQ SFDR spurious free dynamic range second harmonic level ...
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... NXP Semiconductors CLKN CLK IOUT/IOUTN, QOUT/QOUTN Fig 5. Input timing diagram DAC1003D160_2 Product data sheet Dual 10 bits DAC 160 MHz interpolation t su(i) t h(i) Rev. 02 — 13 August 2008 DAC1003D160 50 % 014aaa534 © NXP B.V. 2008. All rights reserved ...
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... NXP Semiconductors 20 output (dB 100 140 180 0 0.2 0.4 normalized frequency f Fig 6. FIR filter frequency response Table 7. Coefficient H(1) H(2) H(3) H(4) H(5) H(6) H(7) H(8) H(9) H(10) H(11) H(12) H(13) H(14) H(15) H(16) H(17) H(18) H(19) H(20) H(21) H(22) DAC1003D160_2 ...
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... NXP Semiconductors 11. Application information R s CLK V CCA 1 k CLKN 100 nF AGND 014aaa539 Fig 8. Single-ended clock schematic DAC1003D160_2 Product data sheet Dual 10 bits DAC 160 MHz interpolation DAC1003D160 V Fig 9. Differential clock schematic Rev. 02 — 13 August 2008 DAC1003D160 AGND DAC1003D160 1 k CLK 100 nF ...
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... NXP Semiconductors AGND 3 CCA 1 3 CCA 3 3 AGND AGND 4 CLK 5 CLKN 6 AGND AGND 7 i.c. 8 DGND DGND CCD 10 3 DGND DGND 17 C DEC All resistors are 1 % precision resistors 100 nF. Fig 10. Application diagram DAC1003D160_2 Product data sheet Dual 10 bits DAC 160 MHz interpolation ...
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... NXP Semiconductors 11.1 Alternative parts The following alternative parts are also available: Table 8. Type number DAC1403D160 DAC1203D160 [1] Pin to pin compatible DAC1003D160_2 Product data sheet Dual 10 bits DAC 160 MHz interpolation Alternative parts Description Dual 14 bits DAC, with 2 interpolating Dual 12 bits DAC, ...
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... NXP Semiconductors 12. Package outline HTQFP80: plastic thermal enhanced thin quad flat package; 80 leads; body mm; exposed die pad y exposed die pad pin 1 index DIMENSIONS (mm are the original dimensions) A UNIT max 0.15 1.05 0.27 mm 1.2 0.25 0.05 0.95 0.17 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included ...
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... NXP Semiconductors 13. Abbreviations Table 9. Acronym FIR IF LSB MSB PLL PMOS 14. Glossary 14.1 Static parameters DNL — Differential Non-Linearity. The difference between the ideal and the measured output value between successive DAC codes. INL — Integral Non-Linearity. The deviation of the transfer function from a best-fit straight line (linear regression computation) ...
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... NXP Semiconductors 15. Revision history Table 10. Revision history Document ID Release date DAC1003D160_2 20080813 • Modifications: Added condition to t • Correction to DAC1003D160_1 20080612 DAC1003D160_2 Product data sheet Dual 10 bits DAC 160 MHz interpolation Data sheet status Change notice Product data sheet - in Table 5 ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 6 8 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7 11 Application information 11.1 Alternative parts . . . . . . . . . . . . . . . . . . . . . . . 14 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 13 Abbreviations ...