TS68EN360MAB/Q33L E2V, TS68EN360MAB/Q33L Datasheet - Page 81

• Manufacturer Part Number: TS68EN360MAB/Q33L
• Manufacturer: E2V

Specifications of TS68EN360MAB/Q33L

• Operating Temperature (max): 125C
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Lead Free Status / Rohs Status: Not Compliant

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0886C–HIREL–04/08
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10 Handling ................................................................................................. 76
11 Package Mechanical Data ..................................................................... 77
12 Ordering Information ............................................................................. 79
Functional Description .......................................................................... 73
Preparation for Delivery ........................................................................ 76
7.90 40 Bus Type Slave Mode Bus Arbitration AC Electrical Specifications .............. 39
7.10 040 Bus Type Slave Mode Internal Read/Write/Lack Cycles AC Electrical
7.11 040 Bus Type SRAM/DRAM Cycles AC Electrical Specifications ...................... 43
7.12 IDMA AC Electrical Specifications ...................................................................... 49
7.13 PIP/PIO Electrical Specifications ........................................................................ 51
7.14 Interrupt Controller AC Electrical Specifications ................................................. 53
7.15 BAUD Rate Generator AC Electrical Specifications ........................................... 54
7.16 Timer Electrical Specifications ........................................................................... 55
7.17 SI Electrical Specifications ................................................................................. 56
7.18 SCC in NMSI Mode-external Clock Electrical Specifications ............................. 61
7.19 SCC in NMSI Mode-internal Clock Electrical Specifications .............................. 61
7.20 Ethernet Electrical Specifications ....................................................................... 64
7.21 SMC Transparent Mode Electrical Specifications .............................................. 67
7.22 SPI Master Electrical Specifications ................................................................... 68
7.23 SPI Slave Electrical Specifications ..................................................................... 69
7.24 JTAG Electrical Specifications .......................................................................... 71
8.1 CPU32+ Core ....................................................................................................... 73
8.2 System Integration Module (SIM60) ..................................................................... 73
8.3 Communications Processor Module (CPM) ......................................................... 73
8.4 Ethernet on QUICC ..............................................................................................74
8.5 Upgrading Designs from the TS68302 .................................................................75
9.1 Packaging ............................................................................................................. 76
9.2 Certificate of Compliance ..................................................................................... 76
11.12 41-pin – PGA .................................................................................................... 77
11.22 40-pin – CERQUAD .......................................................................................... 78
Specifications .................................................................................................. 40
8.5.1 Architectural Approach .......................................................................... 75
8.5.2 Hardware Compatibility Issues .............................................................. 75
8.5.3 Software Compatibility Issues ............................................................... 76
e2v semiconductors SAS 2008
TS68EN360