EPF6024AQC208-3N Altera, EPF6024AQC208-3N Datasheet - Page 25

IC FLEX 6000 FPGA 24K 208-PQFP

EPF6024AQC208-3N

Manufacturer Part Number
EPF6024AQC208-3N
Description
IC FLEX 6000 FPGA 24K 208-PQFP
Manufacturer
Altera
Series
FLEX 6000r
Datasheet

Specifications of EPF6024AQC208-3N

Number Of Logic Elements/cells
1960
Number Of Labs/clbs
196
Number Of I /o
171
Number Of Gates
24000
Voltage - Supply
3 V ~ 3.6 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
208-MQFP, 208-PQFP
Family Name
FLEX 6000
Number Of Usable Gates
24000
Number Of Logic Blocks/elements
1960
# I/os (max)
171
Frequency (max)
142.86MHz
Process Technology
SRAM
Operating Supply Voltage (typ)
3.3V
Logic Cells
1960
Device System Gates
24000
Operating Supply Voltage (min)
3V
Operating Supply Voltage (max)
3.6V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
208
Package Type
PQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Total Ram Bits
-
Lead Free Status / Rohs Status
Compliant
Other names
544-1957
EPF6024AQC208-3N

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0
Figure 14. IOE Connection to Column Interconnect
SameFrame
Pin-Outs
Altera Corporation
Any LE can drive a
pin through the row
and local interconnect.
FastFLEX I/O: An
LE can drive a
pin through a local
interconnect for faster
clock-to-output times.
3.3-V FLEX 6000 devices support the SameFrame pin-out feature for
FineLine BGA packages. The SameFrame pin-out feature is the
arrangement of balls on FineLine BGA packages such that the lower-ball-
count packages form a subset of the higher-ball-count packages.
SameFrame pin-outs provide the flexibility to migrate not only from
device to device within the same package, but also from one package to
another. A given printed circuit board (PCB) layout can support multiple
device density/package combinations. For example, a single board layout
can support an EPF6016A device in a 100-pin FineLine BGA package or an
EPF6024A device in a 256-pin FineLine BGA package.
The Altera software packages provide support to design PCBs with
SameFrame pin-out devices. Devices can be defined for present and future
use. The Altera software packages generate pin-outs describing how to lay
out a board to take advantage of this migration (see
Row Interconnect
IOE
Each IOE can drive two
column interconnect channels.
Each IOE data and OE signal is
driven to a local interconnect.
FLEX 6000 Programmable Logic Device Family Data Sheet
LAB
IOE
Column Interconnect
Figure
15).
25

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