XC3SD3400A-5FG676C Xilinx Inc, XC3SD3400A-5FG676C Datasheet - Page 72

SPARTAN-3ADSP FPGA 3400K 676FBGA

XC3SD3400A-5FG676C

Manufacturer Part Number
XC3SD3400A-5FG676C
Description
SPARTAN-3ADSP FPGA 3400K 676FBGA
Manufacturer
Xilinx Inc
Series
Spartan™-3A DSPr

Specifications of XC3SD3400A-5FG676C

Number Of Logic Elements/cells
53712
Number Of Labs/clbs
5968
Total Ram Bits
2322432
Number Of I /o
469
Number Of Gates
3400000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
676-BBGA
For Use With
122-1532 - KIT DEVELOPMENT SPARTAN 3ADSP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
XC3SD3400A-5FG676C
Manufacturer:
XILINX
Quantity:
885
Part Number:
XC3SD3400A-5FG676C
Manufacturer:
Xilinx Inc
Quantity:
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Part Number:
XC3SD3400A-5FG676C
Manufacturer:
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0
User I/Os by Bank
Table 64
The AWAKE pin is counted as a dual-purpose I/O.
Table 64: User I/Os Per Bank for the XC3SD1800A in the CS484 Package
Table 65: User I/Os Per Bank for the XC3SD3400A in the CS484 Package
Footprint Migration Differences
There are no migration footprint differences between the XC3SD1800A and the XC3SD3400A in the CS484 package.
DS610 (v3.0) October 4, 2010
Product Specification
Notes:
1.
Notes:
1.
Top
Right
Bottom
Left
Top
Right
Bottom
Left
Package
Package
TOTAL
19 VREF are on INPUT pins.
TOTAL
19 VREF are on INPUT pins.
Edge
Edge
and
Table 65
I/O Bank
I/O Bank
0
1
2
3
0
1
2
3
indicates how the user-I/O pins are distributed between the four I/O banks on the CS484 package.
Maximum I/Os
Maximum I/O
Input-Only
Input-Only
and
and
309
309
77
78
76
78
77
78
76
78
156
156
I/O
I/O
49
23
33
51
49
23
33
51
www.xilinx.com
INPUT
INPUT
Spartan-3A DSP FPGA Family: Pinout Descriptions
13
13
41
13
13
41
9
6
9
6
All Possible I/O Pins by Type
All Possible I/O Pins by Type
DUAL
DUAL
30
21
52
30
21
52
1
0
1
0
VREF
VREF
28
28
6
8
8
6
6
8
8
6
(1)
(1)
CLK
CLK
32
32
8
8
8
8
8
8
8
8
72

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