XS1-G04B-FB512-C4 XMOS, XS1-G04B-FB512-C4 Datasheet - Page 27

• Manufacturer Part Number: XS1-G04B-FB512-C4
• Description: IC MPU 32BIT QUAD CORE 512FBGA
• Manufacturer: XMOS

Specifications of XS1-G04B-FB512-C4

• Processor Type: XCore 32-Bit
• Speed: 1600MIPS
• Voltage: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Package / Case: 512-BGA
• For Use With: XMOS AVB REF KIT - KIT REF AVB W/4 XS1-G-DK880-1016 - KIT REF LED RGB 16X32 W/XC-3880-1015 - BOARD KIT XS1-G4 LED CTRL TILE880-1014 - BOARD DEV KIT XS1-G4 ETHERNET880-1013 - BOARD DEV KIT XS1-G4880-1012 - KIT DEV 4CORE G4 W/LCD TOUCH
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Other names: 880-1010

XS1-G4 512BGA Datasheet (3.5)
4.2 Package Mechanical Details
A
A1
A2
D
D1
E
E1
b
c
e
f
m
n
REF
Dimensional Ref
0.27
1.02
0.32
Min
1.06
20.0
18.4
20.0
18.4
0.5
0.36
0.8
0.8
24
512
Nom
1.6
1.1
0.40
Max
aaa
bbb
ddd
eee
fff
Dimensional Tol
www.xmos.com
0.15
0.10
0.20
0.15
0.08
1.
2.
3.
4.
5.
6.
7.
8.
All dimensions in mm.
‘e’ represents the basic solder ball pitch.
‘m’ represents the basic solder ball matrix size.
‘n’ is the number of attached solder balls.
‘b’ is measurable at the maximum solder ball
diameter parallel the primary datum – C –.
Dimension ‘aaa’ is measured parallel to primary
datum – C –.
Primary datum – C – and the seating plane are
defined by the spherical crowns of the solder
balls.
The package surface shall be matte finish
charmilles 24 to 27.
The over package thickness ‘A’ already
considers collapse balls.
Notes
27/30