GC80503CSM66166SL388 Intel, GC80503CSM66166SL388 Datasheet - Page 35
GC80503CSM66166SL388
Manufacturer Part Number
GC80503CSM66166SL388
Description
IC MPU 1.9V PENTI 166MHZ 352BGA
Manufacturer
Intel
Datasheet
1.GC80503CSM66166SL388.pdf
(62 pages)
Specifications of GC80503CSM66166SL388
Rohs Status
RoHS non-compliant
Processor Type
Pentium I w/MMX
Features
66MHz Bus
Speed
166MHz
Voltage
1.9V
Mounting Type
Surface Mount
Package / Case
352-BGA
Other names
821225
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3.11
3.11.1
Datasheet
Figure 8. PPGA Package Dimensions
Mechanical Specifications
In mechanical terms, the low-power embedded Pentium processor with MMX technology 296-lead
Plastic Staggered Pin Grid Array (PPGA) is completely identical to the Pentium processor with
MMX technology PPGA package. The pins are arranged in a 37x37 matrix and the package
dimensions are 1.95" x 1.95" (4.95 cm x 4.95 cm). Package summary information for the PPGA
device is provided in Table 13. Figure 8 shows the package dimensions.
The HL-PBGA version of the low-power embedded Pentium processor with MMX technology is a
new package type for the Pentium processor family. Package summary information for the HL-
PBGA device is provided in Table 14. Figure 9 shows the package dimensions.
PPGA Package Mechanical Diagrams
1.65
(Ref)
2.29
1.52
45 Chamfer
(Index Corner)
˚
Low-Power Embedded Pentium
Pin C3
D
D
1
S
1
D
A
B
e
1
L
measurements in mm
Seating Plane
D
®
A
A
2
2
1
Processor with MMX™ Technology
F
2
F
1
Solder Resist
Heat Slug
Chip Capacitor
A5771-01
35
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