GC80503CSM66166SL388 Intel, GC80503CSM66166SL388 Datasheet - Page 38

• Manufacturer Part Number: GC80503CSM66166SL388
• Description: IC MPU 1.9V PENTI 166MHZ 352BGA
• Manufacturer: Intel

Specifications of GC80503CSM66166SL388

• Rohs Status: RoHS non-compliant
• Processor Type: Pentium I w/MMX
• Features: 66MHz Bus
• Speed: 166MHz
• Voltage: 1.9V
• Mounting Type: Surface Mount
• Package / Case: 352-BGA
• Other names: 821225

Low-Power Embedded Pentium
3.12
3.12.1
3.12.2
38
Thermal Specifications
The low-power embedded Pentium processor with MMX technology is specified for proper
operation when case temperature, T
PPGA package, and 0° C to 95° C for the HL-PBGA package.
The Low-Power Embedded Pentium Processor with MMX Technology in the HL-PBGA package
is also available in extended temperature ranges from -40°C to +115°C. For more information, see
the Extended Temperature Pentium
273232.
Measuring Thermal Values
To verify that the proper T
surface (opposite of the pins). The measurement is made in the same way with or without a
heatsink attached. When a heatsink is attached, a hole (smaller than 0.150" diameter) should be
drilled through the heatsink to allow probing the center of the package. See Figure 10 for an
illustration of how to measure T
To minimize the measurement errors, it is recommended to use the following approach:
Thermal Equations and Data
For the low-power embedded Pentium processor with MMX technology, an ambient temperature,
T
met.
The equation used to calculate
Where:
T
P
A
•
•
•
•
•
CA
A
(air temperature around the processor), is not specified directly. The only restriction is that T
and T
Use 36-gauge or finer diameter K, T, or J type thermocouples. The laboratory testing was done
using a thermocouple made by Omega* (part number 5TC-TTK-36-36).
Attach the thermocouple bead or junction to the center of the package top surface using high
thermal conductivity cements. The laboratory testing was done by using Omega Bond (part
number OB-101).
The thermocouple should be attached at a 90-degree angle as shown in Figure 10.
The hole size should be smaller than 0.150" in diameter.
Make sure there is no contact between thermocouple cement and heatsink base. The contact
will affect the thermocouple reading.
C
=
=
=
Ambient and case temperature (°C)
Case-to-ambient thermal resistance (°C/Watt)
Maximum power consumption (Watt)
®
Processor with MMX™ Technology
C
is maintained, it should be measured at the center of the package top
C
CA
.
®
CASE
is:
Processor with MMX™ Technology datasheet, order number
(T
CA
C
), is within the specified range of 0° C to 85° C for the
=
T
C
P
– T
A
Datasheet
C
is