MPC8260AZUPIBB Freescale Semiconductor, MPC8260AZUPIBB Datasheet - Page 17

IC MPU POWERQUICC II 480-TBGA

MPC8260AZUPIBB

Manufacturer Part Number
MPC8260AZUPIBB
Description
IC MPU POWERQUICC II 480-TBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC IIr
Datasheets

Specifications of MPC8260AZUPIBB

Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
300MHz
Voltage
2V
Mounting Type
Surface Mount
Package / Case
480-TBGA
Core Size
32 Bit
Program Memory Size
32KB
Cpu Speed
300MHz
Embedded Interface Type
I2C, MII, SPI, TDM, UTOPIA
Digital Ic Case Style
TBGA
No. Of Pins
480
Rohs Compliant
No
For Use With
MPC8260ADS-TCOM - BOARD DEV ADS POWERQUICC II
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8260AZUPIBB
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
MPC8260AZUPIBB
Quantity:
100
1
Table 10
Figure 8
Freescale Semiconductor
Note:
Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal. Timings are
measured at the pin.
sp33a
sp33b
sp31
sp32
sp34
sp35
Max
Spec Number
shows TDM input and output signals.
lists SIU output characteristics.
MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2
sp30
sp30
sp30
sp30
sp30
sp30
Min
Activating data pipelining (setting BRx[DR] in the memory controller)
improves the AC timing. When data pipelining is activated, sp12 can be
used for data bus setup even when ECC or PARITY are used. Also, sp33a
can be used as the AC specification for DP signals.
Note: There are four possible TDM timing conditions:
1. Input sampled on the rising edge and output driven on the rising edge (shown).
2. Input sampled on the rising edge and output driven on the falling edge.
3. Input sampled on the falling edge and output driven on the falling edge.
4. Input sampled on the falling edge and output driven on the rising edge.
PSDVAL/TEA/TA
ADD/ADD_atr./BADDR/CI/GBL/WT
Data bus
DP
memc signals/ALE
all other signals
TDM output signals
TDM input signals
Serial CLKin
Table 10. AC Characteristics for SIU Outputs
Figure 8. TDM Signal Diagram
Characteristic
NOTE
sp20
sp40/sp41
sp21
1
Electrical and Thermal Characteristics
Max Delay (ns)
66 MHz
7.5
10
12
8
8
6
Min Delay (ns)
66 MHz
0.5
0.5
0.5
0.5
0.5
0.5
17

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