MPC8260AZUPIBB Freescale Semiconductor, MPC8260AZUPIBB Datasheet - Page 37

IC MPU POWERQUICC II 480-TBGA

MPC8260AZUPIBB

Manufacturer Part Number
MPC8260AZUPIBB
Description
IC MPU POWERQUICC II 480-TBGA
Manufacturer
Freescale Semiconductor
Series
PowerQUICC IIr
Datasheets

Specifications of MPC8260AZUPIBB

Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
300MHz
Voltage
2V
Mounting Type
Surface Mount
Package / Case
480-TBGA
Core Size
32 Bit
Program Memory Size
32KB
Cpu Speed
300MHz
Embedded Interface Type
I2C, MII, SPI, TDM, UTOPIA
Digital Ic Case Style
TBGA
No. Of Pins
480
Rohs Compliant
No
For Use With
MPC8260ADS-TCOM - BOARD DEV ADS POWERQUICC II
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC8260AZUPIBB
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
MPC8260AZUPIBB
Quantity:
100
5
The following sections provide the package parameters and mechanical dimensions for the MPC8260.
5.1
Package parameters are provided in
Freescale Semiconductor
UTS
UT8
UT16
MII
Package Description
MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2
Package Parameters
Symbol
Package Outline
Interconnects
Pitch
Nominal unmounted package height 1.55 mm
Table 15. Symbol Legend (continued)
Parameter
Table
Table 16. Package Parameters
16. The package type is a 37.5 × 37.5 mm, 480-lead TBGA.
Indicates that a signal is part of the UTOPIA slave interface
Indicates that a signal is part of the 8-bit UTOPIA interface
Indicates that a signal is part of the 16-bit UTOPIA interface
Indicates that a signal is part of the media independent interface
37.5 x 37.5 mm
480 (29 x 29 ball array)
1.27 mm
Value
Meaning
Package Description
37

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