LE80538VE0041M Intel, LE80538VE0041M Datasheet - Page 27

IC PROC CELERON M 1.06GHZ 479BGA

LE80538VE0041M

Manufacturer Part Number
LE80538VE0041M
Description
IC PROC CELERON M 1.06GHZ 479BGA
Manufacturer
Intel
Datasheet

Specifications of LE80538VE0041M

Processor Type
Celeron M
Features
533MHZ Bus, 1M L2 Cache
Speed
1.06GHz
Voltage
0.94V
Mounting Type
Surface Mount
Package / Case
479-BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
883549

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LE80538VE0041M
Manufacturer:
Intel
Quantity:
10 000
Intel
®
Table 11. AGTL+ Signal Group DC Specifications
Table 12. CMOS Signal Group DC Specifications
Celeron
®
M Processor Datasheet
NOTES:
.
NOTES:
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. V
3. V
4. V
5. This is the pull down driver resistance. Refer to processor I/O Buffer Models for I/V characteristics. Measured
6. GTLREF should be generated from VCCP with a 1% tolerance resistor divider. The VCCP referred to in these
7. R
8. Specified with on die R
9. Cpad includes die capacitance only. No package parasitics are included.
1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2. The VCCP referred to in these specifications refers to instantaneous VCCP.
3. Refer to the processor I/O Buffer Models for I/V characteristics.
4. Measured at 0.1
VCCP
GTLREF
V
V
V
R
I
Cpad
VCCP
V
V
V
V
I
I
I
Cpad
Symbol
LI
OL
OH
LI
IH
IL
OH
ON
IL
IH
OL
OH
Symbol
value.
signal quality specifications in
at 0.31
specifications is the instantaneous VCCP.
VCCP. R
IL
IH
IH
TT
R
is defined as the maximum voltage level at a receiving agent that will be interpreted as a logical low value.
is defined as the minimum voltage level at a receiving agent that will be interpreted as a logical high
and V
TT
is the on-die termination resistance measured at V
x
I/O Voltage
Input Low Voltage
CMOS
Input High Voltage
Output Low Voltage
Output High Voltage
Output Low Current
Output High Current
Leakage Current
Pad Capacitance
TT
VCCP. R
OH
is connected to VCCP on die. Refer to processor I/O buffer models for I/V characteristics.
I/O Voltage
Reference Voltage
Input High Voltage
Input Low Voltage
Output High Voltage
Termination Resistance
Buffer On Resistance
Input Leakage Current
Pad Capacitance
may experience excursions above VCCP. However, input signal drivers must comply with the
Parameter
x
ON
VCCP.
Parameter
(min) = 0.38
TT
and R
Chapter
ON
x
are turned off.
0.997
-0.1
0.7
-0.1
0.9
1.49
1.49
1.0
R
TT
4.
,
0.997
2/3 VCCP -
2%
GTLREF+0.1
-0.1
47
17.7
1.8
x
x
R
Min
VCCP
VCCP
ON
Min
(typ) = 0.45
1.05
0
VCCP
2.3
OL
1.05
2/3 VCCP
VCCP
55
24.7
2.3
Typ
x
of the AGTL+ output driver. Measured at 0.31
R
TT
Typ
,
R
ON
1.102
0.3
VCCP+0.1
0.1
VCCP+0.1
4.08
4.08
± 100
3.0
(max) = 0.52
x
x
Max
1.102
2/3 VCCP +
2%
VCCP+0.1
GTLREF-0.1
63
32.9
± 100
2.75
VCCP
VCCP
Electrical Specifications
Max
x
R
Unit Notes
V
V
V
V
V
mA
mA
µA
pF
TT
.
Unit Notes
V
V
V
V
W
µA
pF
2, 3
2
2
2
4
5
6
7
W
6
3,4,6
2
4,6
5
8
9
1
7
x
1
27

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