LE80538VE0041M Intel, LE80538VE0041M Datasheet - Page 63

• Manufacturer Part Number: LE80538VE0041M
• Description: IC PROC CELERON M 1.06GHZ 479BGA
• Manufacturer: Intel

Specifications of LE80538VE0041M

• Processor Type: Celeron M
• Features: 533MHZ Bus, 1M L2 Cache
• Speed: 1.06GHz
• Voltage: 0.94V
• Mounting Type: Surface Mount
• Package / Case: 479-BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 883549

5
Intel
®
Celeron
®
M Processor Datasheet
Thermal Specifications and
Design Considerations
The Intel Celeron M processor requires a thermal solution to maintain temperatures within
operating limits. A complete thermal solution includes both component and system level thermal
management features. Component level thermal solutions include active or passive heatsinks or
heat exchangers attached to the processor exposed die. The solution should make firm contact with
the die while maintaining processor mechanical specifications such as pressure. A typical system
level thermal solution may consist of a processor fan ducted to a heat exchanger that is thermally
coupled to the processor using a heat pipe or direct die attachment. A secondary fan or air from the
processor fan may also be used to cool other platform components or lower the internal ambient
temperature within the system. The processor must remain within the minimum and maximum
junction temperature (Tj) specifications at the corresponding thermal design power (TDP) value
listed in
Thermal Monitor in the processor.
Refer to
cause the processor to consume the theoretical maximum power dissipation for sustained time
periods. Intel recommends that complete thermal solution designs target the TDP indicated in
Table
unlikely event that an application exceeds the TDP recommendation for a sustained period of time.
For more details on the usage of this feature, refer to
Monitor feature must be enabled for the processor to remain within specification.
26. The Intel
Table
Section 5.1.2
26. The maximum junction temperature is defined by an activation of the Intel
®
Thermal Monitor feature is designed to help protect the processor in the
for more details. Analysis indicates that real applications are unlikely to
Thermal Specifications and Design Considerations
Section
5.1.2. In all cases the Intel Thermal
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