FW80200M733SL678 Intel, FW80200M733SL678 Datasheet - Page 3

• Manufacturer Part Number: FW80200M733SL678
• Description: IC I/O PROCESSOR 733MHZ 241-BGA
• Manufacturer: Intel

Specifications of FW80200M733SL678

• Rohs Status: RoHS non-compliant
• Processor Type: I/O
• Features: XScale Core
• Speed: 733MHz
• Voltage: 5V
• Mounting Type: Surface Mount
• Package / Case: 241-BGA
• Other names: 844850

Datasheet - Commercial and Extended Temperature (80200T)
Contents
1.0
2.0
3.0
4.0
About this Document .......................................................................................................... 5
Functional Overview........................................................................................................... 5
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
2.13
2.14
Package Information ........................................................................................................13
3.1
3.2
3.3
Electrical Specifications....................................................................................................24
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
Superpipeline ........................................................................................................7
Branch Target Buffer (BTB)................................................................................... 8
Instruction Memory Management Unit (IMMU) ..................................................... 8
Data Memory Management Unit (DMMU)............................................................. 9
Instruction Cache (I-Cache) .................................................................................. 9
Data Cache (D-Cache)........................................................................................10
Mini-Data Cache..................................................................................................10
Fill Buffer (FB) and Pend Buffer (PB) ..................................................................11
Write Buffer (WB) ................................................................................................11
Multiply-Accumulate Coprocessor (CP0) ............................................................11
Clock and Power Management ...........................................................................12
Performance Monitoring Unit (PMU) ...................................................................12
Debug Unit ..........................................................................................................12
Extended Temperature (80200T) ........................................................................12
Package Introduction...........................................................................................13
3.1.1
3.1.2
Package Thermal Specifications .........................................................................22
Package Thermal Resistance .............................................................................22
Absolute Maximum Ratings.................................................................................24
V
Targeted DC Specifications.................................................................................26
Targeted AC Specifications.................................................................................27
4.4.1
4.4.2
4.4.3
AC Timing Waveforms ........................................................................................30
Power Sequence .................................................................................................32
Reset Timing .......................................................................................................34
AC Test Conditions .............................................................................................34
Typical Power Dissipation ...................................................................................35
CCA
Pin Requirements ......................................................................................25
Functional Signal Definitions ..................................................................13
3.1.1.1 Signal Pin Descriptions .............................................................13
241 Lead PBGA Package ......................................................................17
Clock Signal Timings..............................................................................27
Bus Signal Timings.................................................................................28
Boundary Scan Test Signal Timings ......................................................29
Intel
®
80200 Processor based on Intel
®
January 2003
XScale
™
Microarchitecture
3