UDA1355H/N2,518 NXP Semiconductors, UDA1355H/N2,518 Datasheet - Page 2

• Manufacturer Part Number: UDA1355H/N2,518
• Description: IC CODEC STER/SUDIO SPDIF 44QFP
• Manufacturer: NXP Semiconductors
• Type: Stereo Audior

Specifications of UDA1355H/N2,518

• Data Interface: I²C, Serial
• Resolution (bits): 24 b
• Number Of Adcs / Dacs: 2 / 2
• Sigma Delta: No
• S/n Ratio, Adcs / Dacs (db) Typ: 97 / 98
• Voltage - Supply, Analog: 2.7 V ~ 5.5 V
• Voltage - Supply, Digital: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 44-QFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935271552518

NXP Semiconductors
CONTENTS
1
1.1
1.2
1.3
1.4
1.5
1.6
1.7
2
3
4
5
6
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
8
8.1
8.2
8.3
8.4
9
9.1
9.2
9.3
10
10.1
10.2
10.3
10.4
2003 Apr 10
Stereo audio codec with SPDIF interface
IEC 60958 output
Power-on reset
FEATURES
General
Control
IEC 60958 input
Digital I/O interface
ADC digital sound processing
DAC digital sound processing
GENERAL DESCRIPTION
ORDERING INFORMATION
QUICK REFERENCE DATA
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
IC control
Microcontroller interface
Clock systems
IEC 60958 decoder
IEC 60958 encoder
Analog input
Analog output
Digital audio input and output
APPLICATION MODES
Static mode pin assignment
Static mode basic applications
Microcontroller mode pin assignment
Microcontroller mode applications
SPDIF SIGNAL FORMAT
SPDIF channel encoding
SPDIF hierarchical layers
Timing characteristics
L3-BUS DESCRIPTION
Device addressing
Register addressing
Data write mode
Data read mode
2
11
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
11.9
11.10
12
12.1
12.2
12.3
13
14
15
16
17
18
18.1
18.2
18.3
18.4
18.5
19
20
21
I
Characteristics
Bit transfer
Byte transfer
Data transfer
Register address
Device address
Start and stop conditions
Acknowledgment
Write cycle
Read cycle
REGISTER MAPPING
Address mapping
Read/write registers mapping
Read registers mapping
LIMITING VALUES
THERMAL CHARACTERISTICS
CHARACTERISTICS
TIMING CHARACTERISTICS
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DATA SHEET STATUS
DISCLAIMERS
TRADEMARKS
2
C-BUS DESCRIPTION
Preliminary specification
UDA1355H