DSPIC30F3011-30I/PT Microchip Technology Inc., DSPIC30F3011-30I/PT Datasheet - Page 234

• Manufacturer Part Number: DSPIC30F3011-30I/PT
• Description: 16 BIT MCU/DSP 44LD 30MIPS 24 KB FLASH
• Manufacturer: Microchip Technology Inc.
• Type: DSPr

Specifications of DSPIC30F3011-30I/PT

• A/d Inputs: 9-Channels, 10-Bit
• Cpu Speed: 30 MIPS
• Eeprom Memory: 1K Bytes
• Input Output: 30
• Interface: I2C/SPI/UART, USART
• Ios: 30
• Memory Type: Flash
• Number Of Bits: 16
• Package Type: 44-pin TQFP
• Programmable Memory: 24K Bytes
• Ram Size: 1K Bytes
• Timers: 5-16-bit, 2-32-bit
• Voltage, Range: 2.5-5.5
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

dsPIC30F
80-Lead Plastic Thin Quad Flatpack 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS70082G-page 232
B
c
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
JEDEC Equivalent: MS-026
Drawing No. C04-116
β
*Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .010" (0.254mm) per side.
p
Dimension Limits
#leads=n1
E1
E
Units
n1
A2
E1
D1
A1
(F)
E
D
B
n
p
A
φ
c
α
β
L
n
MIN
.037
.002
.018
.004
Preliminary
.011
11
11
0
2
1
φ
.630 BSC
.630 BSC
.551 BSC
.551 BSC
INCHES
D1
L
NOM
D
.024
.026
.039
.039
.013
3.5
80
20
12
12
A
A1
MAX
.047
.006
.030
.008
.015
.041
13
13
7
(F)
MIN
0.95
0.05
0.45
0.09
0.27
11
11
0
MILLIMETERS*
 2004 Microchip Technology Inc.
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
NOM
0.65
1.00
0.60
1.00
0.32
3.5
80
20
12
12
MAX
A2
1.20
1.05
0.15
0.75
0.20
0.37
13
13
7
α