WM8311GEB/V Wolfson Microelectronics, WM8311GEB/V Datasheet - Page 290

• Manufacturer Part Number: WM8311GEB/V
• Description: POWER MANAGEMENT SUBSYSTEM, 121BGA
• Manufacturer: Wolfson Microelectronics

Specifications of WM8311GEB/V

• Supply Voltage: 5.5V
• No. Of Step-down Dc - Dc Converters: 4
• No. Of Ldo Regulators: 7
• Digital Ic Case Style: BGA
• No. Of Pins: 121
• No. Of Regulated Outputs: 9
• Operating Temperature Range: -40°C To
• Rohs Compliant: Yes
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

WM8311
31 PACKAGE DIAGRAM
w
NOTES:
1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’.
3. DIMENSION ‘b’ IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM -Z-.
4. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.
5. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY.
6. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.
7. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
8. FALLS WITHIN JEDEC, MO-195
2
Symbols
B: 121 BALL BGA PLASTIC PACKAGE 8
SIDE VIEW
DETAIL 2
REF:
bbb
ddd
aaa
ccc
A1
A2
D1
E1
A2
A
D
E
b
e
f
A
Tolerances of Form and Position
1.08
0.17
0.91
0.25
MIN
A
B
C
D
E
F
G
H
K
L
J
1
11
aaa
Dimensions (mm)
JEDEC, MO-195
10
bbb
Z
Z
9
8.00 BSC
6.50 BSC
8.00 BSC
6.50 BSC
0.65 BSC
0.75 BSC
Z
8
NOM
1.17
0.21
0.10
0.96
0.30
0.08
0.15
0.05
BOTTOM VIEW
A1
7
D1
6
e
5
4
3
MAX
0.26
1.27
1.01
0.35
2
DETAIL 2
1
X
8
DETAIL 1
X
6
e
1.17 mm BODY, 0.65 mm BALL PITCH
NOTE
E1
6
4
2 X
2 X
A1
CORNER
0.10
0.10
Z
Z
SOLDER BALL
DETAIL 1
TOP VIEW
f
D
5
b
f
3
ddd
ccc
PP, December 2009, Rev 3.0
Z
Z
X
E
Y
DM065.A
Pre-Production
290