MT29F1G08ABBDAH4-IT:D Micron Technology Inc, MT29F1G08ABBDAH4-IT:D Datasheet - Page 13
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MT29F1G08ABBDAH4-IT:D
Manufacturer Part Number
MT29F1G08ABBDAH4-IT:D
Description
Manufacturer
Micron Technology Inc
Datasheet
1.MT29F1G08ABBDAH4-ITD.pdf
(93 pages)
Specifications of MT29F1G08ABBDAH4-IT:D
Cell Type
NAND
Density
8Gb
Interface Type
Parallel
Address Bus
27b
Operating Supply Voltage (typ)
1.8V
Operating Temp Range
-40C to 85C
Package Type
VFBGA
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
1.7V
Operating Supply Voltage (max)
1.95V
Word Size
8b
Number Of Words
128M
Supply Current
20mA
Mounting
Surface Mount
Pin Count
63
Lead Free Status / Rohs Status
Supplier Unconfirmed
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MT29F1G08ABBDAH4-IT:D
Manufacturer:
MICRON
Quantity:
1 000
Company:
Part Number:
MT29F1G08ABBDAH4-IT:D
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT29F1G08ABBDAH4-IT:D
Manufacturer:
MIC
Quantity:
20 000
Figure 6: 63-Ball VFBGA (HC)
PDF: 09005aef83e5ffed
m68a.pdf – Rev. D 06/10 EN
Solder ball material:
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-
reflow on Ø0.4 SMD
ball pads.
63X Ø0.45
Seating
plane
0.12 A
8.8 CTR
0.8 TYP
A
Note:
10
1. All dimensions are in millimeters.
9
8
7
10.5 ±0.1
7.2 CTR
0.8 TYP
6
5
4
3
2
1
13
A
B
C
D
E
F
G
H
J
K
L
M
0.65 ±0.05
13 ±0.1
Ball A1 ID
Bottom side saw fiducials may or
may not be covered with soldermask.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1Gb x8, x16: NAND Flash Memory
0.25 MIN
1.0 MAX
Ball A1 ID
Package Dimensions
© 2010 Micron Technology, Inc. All rights reserved.