PSMN3R2-25YLC,115 NXP Semiconductors, PSMN3R2-25YLC,115 Datasheet - Page 5

• Manufacturer Part Number: PSMN3R2-25YLC,115
• Description: MOSFET Power N-Ch 25V 3.4 mOhms
• Manufacturer: NXP Semiconductors
• Series: -r

Specifications of PSMN3R2-25YLC,115

• Transistor Polarity: N-Channel
• Resistance Drain-source Rds (on): 3.4 mOhms
• Drain-source Breakdown Voltage: 25 V
• Gate-source Breakdown Voltage: 20 V
• Continuous Drain Current: 100 A
• Power Dissipation: 79 W
• Maximum Operating Temperature: + 175 C
• Mounting Style: SMD/SMT
• Package / Case: LFPAK
• Gate Charge Qg: 30 nC
• Minimum Operating Temperature: - 55 C
• Fet Type: MOSFET N-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 3.4 mOhm @ 25A, 10V
• Drain To Source Voltage (vdss): 25V
• Current - Continuous Drain (id) @ 25° C: 100A
• Vgs(th) (max) @ Id: 1.95V @ 1mA
• Gate Charge (qg) @ Vgs: 30nC @ 10V
• Input Capacitance (ciss) @ Vds: 1781pF @ 12V
• Power - Max: 79W
• Mounting Type: Surface Mount
• Lead Free Status / Rohs Status: Details
• Other names: 934065203115

NXP Semiconductors
6. Thermal characteristics
Table 6.
PSMN3R2-25YLC
Product data sheet
Symbol
R
Fig 5.
th(j-mb)
Z
(K/W)
th(j-mb)
10
10
10
-1
-2
1
1e-6
Transient thermal impedance from junction to mounting base as a function of pulse duration
δ = 0.5
0.2
0.05
0.02
0.1
Thermal characteristics
Parameter
thermal resistance from junction to
mounting base
single shot
10
-5
N-channel 25 V 3.4 mΩ logic level MOSFET in LFPAK using NextPower
All information provided in this document is subject to legal disclaimers.
10
-4
Rev. 01 — 2 May 2011
Conditions
see
10
Figure 5
-3
10
-2
PSMN3R2-25YLC
Min
-
10
P
-1
t
Typ
1.72
p
T
© NXP B.V. 2011. All rights reserved.
t
p
003aaf842
δ =
(s)
Max
1.9
T
t
p
t
1
Unit
K/W
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