LFE2M50SE-7FN900C Lattice, LFE2M50SE-7FN900C Datasheet - Page 21

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LFE2M50SE-7FN900C

Manufacturer Part Number
LFE2M50SE-7FN900C
Description
FPGA - Field Programmable Gate Array 48K LUTs 410 S Ser Memory DSP 1.2V 7SPD
Manufacturer
Lattice
Datasheet

Specifications of LFE2M50SE-7FN900C

Number Of Macrocells
48000
Number Of Programmable I/os
410
Data Ram Size
4246528
Supply Voltage (max)
1.26 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
0 C
Package / Case
FPBGA-900
Mounting Style
SMD/SMT
Supply Voltage (min)
1.14 V
Number Of Logic Elements/cells
*
Number Of Labs/clbs
*
Total Ram Bits
*
Number Of I /o
*
Number Of Gates
*
Voltage - Supply
*
Mounting Type
*
Operating Temperature
*
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LFE2M50SE-7FN900C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
Lattice Semiconductor
Figure 2-19. Edge Clock Mux Connections
sysMEM Memory
LatticeECP2/M devices contains a number of sysMEM Embedded Block RAM (EBR). The EBR consists of an 18-
Kbit RAM with dedicated input and output registers.
sysMEM Memory Block
The sysMEM block can implement single port, dual port or pseudo dual port memories. Each block can be used in
a variety of depths and widths as shown in Table 2-6. FIFOs can be implemented in sysMEM EBR blocks by imple-
menting support logic with PFUs. The EBR block facilitates parity checking by supporting an optional parity bit for
each data byte. EBR blocks provide byte-enable support for configurations with18-bit and 36-bit data widths.
GPLL Output CLKOP
GPLL Output CLKOS
DLL Output CLKOP
DLL Output CLKOS
Clock Input Pad
GPLL Input Pad
GPLL Input Pad
Input Pad
Input Pad
Routing
Routing
Routing
CLKO
CLKO
2-18
Top and Bottom
ECLK1/ ECLK2
Left and Right
Left and Right
Edge Clocks
Edge Clocks
Edge Clocks
(Both Mux)
LatticeECP2/M Family Data Sheet
ECLK1
ECLK2
Architecture

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