M25PX64-VMF6TP Micron Technology Inc, M25PX64-VMF6TP Datasheet - Page 62

• Manufacturer Part Number: M25PX64-VMF6TP
• Manufacturer: Micron Technology Inc

Specifications of M25PX64-VMF6TP

• Cell Type: NOR
• Density: 64Mb
• Access Time (max): 8ns
• Interface Type: Serial (SPI)
• Address Bus: 24b
• Operating Supply Voltage (typ): 3.3V
• Operating Temp Range: -40C to 85C
• Package Type: SOIC W
• Sync/async: Synchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8b
• Number Of Words: 8M
• Supply Current: 12mA
• Mounting: Surface Mount
• Pin Count: 16
• Lead Free Status / Rohs Status: Supplier Unconfirmed

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Package mechanical
In order to meet environmental requirements, Numonyx offers these devices in RoHS
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
Figure 36. VDFPN8 (MLP8, ME) 8-lead very thin dual flat package no lead,
1. Drawing is not to scale.
2. The circle in the top view of the package indicates the position of pin 1.
Table 19.
1. D2 Max must not exceed (D – 2 x K – 2 × L).
Symbol
ddd
A1
D2
E2
L1
D
N
A
E
K
b
e
L
8 × 6 mm, package outline
VDFPN8 (MLP8, ME) 8-lead very thin dual flat package no lead,
8 × 6 mm, package mechanical data
A
E
A1
0.85
0.40
8.00
5.16
6.00
4.80
1.27
0.50
Typ
Millimeters
0.00
0.35
0.82
0.45
Min
–
8
D
Max
1.00
0.05
0.48
0.05
0.60
0.15
(1)
–
E2
ddd
L
0.033
0.016
0.315
0.203
0.236
0.189
0.050
0.020
Typ
K
D2
Inches
0.000
0.014
0.032
0.018
VDFPN-02
Min
–
8
L1
e
b
0.039
0.002
0.019
0.002
0.024
0.006
Max
–