MT48H8M16LFB4-75 IT:KTR Micron Technology Inc, MT48H8M16LFB4-75 IT:KTR Datasheet - Page 14

• Manufacturer Part Number: MT48H8M16LFB4-75 IT:KTR
• Manufacturer: Micron Technology Inc

Specifications of MT48H8M16LFB4-75 IT:KTR

• Lead Free Status / Rohs Status: Compliant

Figure 6: 90-Ball VFBGA (8mm x 13mm)
PDF: 09005aef832ff1ea
128mb_mobile_sdram_y35M.pdf - Rev. G 10/09 EN
Dimensions apply
to solder balls post-
reflow. Pre-reflow
balls are Ø0.42 on
Ø0.4 SMD ball pads.
Seating
90X Ø0.45
plane
0.1 A
11.2
0.8 TYP
5.6
A
Note:
9
8
3.2
7
1. All dimensions are in millimeters.
8 ±0.1
6.4
Ball A1 ID
4 ±0.05
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
128Mb: 8 Meg x 16, 4 Meg x 32 Mobile SDRAM
6.5 ±0.05
0.65 ±0.05
0.8 TYP
14
13 ±0.1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1.0 MAX
Solder ball material:
Substrate material: plastic laminate
Mold compound: epoxy novolac
SAC105 (98.5% Sn, 1%Ag, 0.5% Cu)
Package Dimensions
©2008 Micron Technology, Inc. All rights reserved.
Ball A1 ID