MC68HC705C8ACB Freescale Semiconductor, MC68HC705C8ACB Datasheet - Page 197

• Manufacturer Part Number: MC68HC705C8ACB
• Manufacturer: Freescale Semiconductor

Specifications of MC68HC705C8ACB

• Cpu Family: HC05
• Device Core Size: 8b
• Frequency (max): 2.1MHz
• Interface Type: SCI/SPI
• Program Memory Type: EPROM
• Program Memory Size: 8KB
• Total Internal Ram Size: 304Byte
• # I/os (max): 24
• Number Of Timers - General Purpose: 1
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 3V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Through Hole
• Pin Count: 42
• Package Type: SPDIP
• Lead Free Status / Rohs Status: Not Compliant

14.8 42-Pin Shrink Dual In-Line Package (SDIP)
MC68HC705C8A — Rev. 3
MOTOROLA
SEATING
PLANE
-T-
42
1
Figure 14-6. MC68HC705C8AB Package Dimensions (Case #858)
D
F
42 PL
0.25 (0.010)
-A-
M
G
T A
Freescale Semiconductor, Inc.
For More Information On This Product,
S
22
21
N
Go to: www.freescale.com
Mechanical Specifications
C
-B-
K
J
42 PL
0.25 (0.010)
H
M
L
T B
M
42-Pin Shrink Dual In-Line Package (SDIP)
S
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
Y14.5M, 1982.
FORMED PARALLEL.
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
DIM
A
B
C
D
G
H
K
M
N
F
J
L
1.435
0.540
0.155
0.014
0.032
0.008
0.115
0.020
MIN
0.070 BSC
0.300 BSC
0.600 BSC
0
Mechanical Specifications
INCHES
1.465
0.560
0.200
0.022
0.046
0.015
0.135
0.040
MAX
15
36.45
13.72
MILLIMETERS
3.94
0.36
0.81
0.20
2.92
0.51
MIN
1.778 BSC
15.24 BSC
0
7.62 BSC
Technical Data
37.21
14.22
MAX
5.08
0.56
1.17
0.38
3.43
1.02
15