LH28F008BVT-BTL10 Sharp Electronics, LH28F008BVT-BTL10 Datasheet - Page 7

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LH28F008BVT-BTL10

Manufacturer Part Number
LH28F008BVT-BTL10
Description
Manufacturer
Sharp Electronics
Datasheet

Specifications of LH28F008BVT-BTL10

Cell Type
NOR
Density
8Mb
Access Time (max)
100ns
Interface Type
Parallel
Boot Type
Bottom
Address Bus
20b
Operating Supply Voltage (typ)
3.3V
Operating Temp Range
0C to 70C
Package Type
TSOP
Program/erase Volt (typ)
3.3/5/12V
Sync/async
Asynchronous
Operating Temperature Classification
Commercial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8b
Number Of Words
1M
Supply Current
30mA
Mounting
Surface Mount
Pin Count
40
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LH28F008BVT-BTL10
Manufacturer:
SHARP
Quantity:
20 000
DQ
Symbol
A
GND
WE#
WP#
CE#
OE#
V
RP#
0
V
NC
0
-A
-DQ
CC
PP
19
7
OUTPUT
SUPPLY
SUPPLY
SUPPLY GROUND: Do not float any ground pins.
INPUT/
INPUT
INPUT
INPUT
INPUT
INPUT
INPUT
Type
ADDRESS INPUTS: Inputs for addresses during read and write operations. Addresses are
internally latched during a write cycle.
A
DATA INPUT/OUTPUTS: Inputs data and commands during CUI write cycles; outputs data
during memory array, status register and identifier code read cycles. Data pins float to high-
impedance when the chip is deselected or outputs are disabled. Data is internally latched during a
write cycle.
CHIP ENABLE: Activates the device’s control logic, input buffers, decoders and sense amplifiers.
CE#-high deselects the device and reduces power consumption to standby levels.
RESET/DEEP POWER-DOWN: Puts the device in deep power-down mode and resets internal
automation. RP#-high enables normal operation. When driven low, RP# inhibits write operations
which provides data protection during power transitions. Exit from deep power-down sets the
device to read array mode. With RP#=V
without WP# state. Block erase or byte write with V
should not be attempted.
OUTPUT ENABLE: Gates the device’s outputs during a read cycle.
WRITE ENABLE: Controls writes to the CUI and array blocks. Addresses and data are latched on
the rising edge of the WE# pulse.
WRITE PROTECT: Master control for boot blocks locking. When V
be erased and programmed.
BLOCK ERASE AND BYTE WRITE POWER SUPPLY: For erasing array blocks or writing
bytes. With V
invalid V
DEVICE POWER SUPPLY: Do not float any power pins. With V
the flash memory are inhibited. Device operations at invalid V
produce spurious results and should not be attempted.
NO CONNECT: Lead is not internal connected; it may be driven or floated.
16
-A
19
PP
: Main Block Address. (Boot and Parameter block Addresses are A
(see DC Characteristics) produce spurious results and should not be attempted.
PP
V
PPLK
Table 2. Pin Descriptions
, memory contents cannot be altered. Block erase and byte write with an
Name and Function
HH
, block erase or byte write can operate to all blocks
IH
<RP#<V
CC
HH
voltage (see DC Characteristics)
CC
produce spurious results and
IL
V
, locked boot blocks cannot
LKO
, all write attempts to
13
-A
19
.)
Rev. 1.1

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