S29GL032M10TAIR10 AMD (ADVANCED MICRO DEVICES), S29GL032M10TAIR10 Datasheet - Page 21

• Manufacturer Part Number: S29GL032M10TAIR10
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of S29GL032M10TAIR10

• Lead Free Status / Rohs Status: Not Compliant

Notes:
1.
2.
3.
4.
5.
6.
February 7, 2007 S29GL-M_00_B8
S29GL064M
Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be packed in Types 0, 2, or 3.
This package is recommended for new designs using TSOPs.
TSOP package marking omits packing type designator from the ordering part number.
BGA package marking omits leading “S29” and packing type designator from the ordering part number.
100% Matte Sn is used for Pb-free TSOP plating.
SnBi is used for Pb-free TSOP plating.
Number
Device
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to
confirm availability of specific valid combinations and to check on newly released combinations.
90, 10, 11
Option
Speed
S29GL064M Valid Combinations
Package, Material, &
Temperature Range
Table 2. S29GL064M Ordering Options
TBI, TCI
TAI, TDI
BAI, BFI
D a t a
TAI, TFI
FAI, FFI
S29GL-M MirrorBit
Valid Combinations
S h e e t
R0,R3,R4,R6,R7
R1,R2,R3,R4,R5
R0,R3,R4,R5
TM
Number
R1,R2
R2,R7
Model
Flash Family
R9
(Note
Packing
0,2,3
Type
1)
TS048 (2, 3, 5)
TS056 (2, 3, 5)
FPT-48P-M19 (3, 6)
FPT-56P-M01 (3, 6)
FBE063 (4, 6)
LAA064 (4)
Package Description
(Notes)
TSOP
Fine-Pitch BGA
Fortified BGA
19