XPC850ZT50B Freescale Semiconductor, XPC850ZT50B Datasheet - Page 67

• Manufacturer Part Number: XPC850ZT50B
• Manufacturer: Freescale Semiconductor

Specifications of XPC850ZT50B

• Family Name: MPC8xx
• Device Core: PowerQUICC
• Device Core Size: 32b
• Frequency (max): 50MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 3.3V
• Operating Supply Voltage (max): 3.465V
• Operating Supply Voltage (min): 3.135V
• Operating Temp Range: 0C to 95C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 256
• Package Type: BGA
• Lead Free Status / Rohs Status: Not Compliant

Pin Assignments and Mechanical Dimensions of the PBGA
Table 9-27 identifies the packages and operating frequencies available for the MPC850.
9.1
The original pin numbering of the MPC850 conformed to a Motorola proprietary pin
numbering scheme that has since been replaced by the JEDEC pin numbering standard for
this package type. To support customers that are currently using the non-JEDEC pin
numbering scheme, two sets of pinouts, JEDEC and non-JEDEC, are presented in this
document.
67
256-Lead Plastic Ball Grid Array
(ZT suffix)
256-Lead Plastic Ball Grid Array
(CZT suffix)
Pin Assignments and Mechanical Dimensions of
the PBGA
Package Type
Table 9-27. MPC850 Package/Frequency/Availability
Freescale Semiconductor, Inc.
MPC850 (Rev. A/B/C) Hardware Specifications
For More Information On This Product,
Frequency (MHz)
Go to: www.freescale.com
50
66
80
50
66
80
Temperature (Tj)
-40°C to 95°C
0°C to 95°C
0°C to 95°C
0°C to 95°C
XPC850ZT50BU
XPC850DEZT50BU
XPC850SRZT50BU
XPC850DSLZT50BU
XPC850ZT66BU
XPC850DEZT66BU
XPC850SRZT66BU
XPC850ZT80BU
XPC850DEZT80BU
XPC850SRZT80BU
XPC850CZT50BU
XPC850DECZT50BU
XPC850SRCZT50BU
XPC850DSLCZT50BU
XPC850CZT66BU
XPC850DECZT66BU
XPC850SRCZT66BU
XPC850CZT80B
XPC850DECZT80B
XPC850SRCZT80B
Order Number
MOTOROLA