XPC850ZT50B Freescale Semiconductor, XPC850ZT50B Datasheet - Page 8

XPC850ZT50B

Manufacturer Part Number
XPC850ZT50B
Description
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of XPC850ZT50B

Family Name
MPC8xx
Device Core
PowerQUICC
Device Core Size
32b
Frequency (max)
50MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
3.3V
Operating Supply Voltage (max)
3.465V
Operating Supply Voltage (min)
3.135V
Operating Temp Range
0C to 95C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
256
Package Type
BGA
Lead Free Status / Rohs Status
Not Compliant

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1
2
This device contains circuitry protecting against damage due to high-static voltage or
electrical fields; however, it is advised that normal precautions be taken to avoid application
of any voltages higher than maximum-rated voltages to this high-impedance circuit.
Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage
level (for example, either GND or V
characteristics for the MPC850.
8
(GND = 0V)
Supply voltage
Input voltage
Junction temperature
Storage temperature range
Functional operating conditions are provided with the DC electrical specifications in Table 4-5. Absolute maximum
ratings are stress ratings only; functional operation at the maxima is not guaranteed. Stress beyond those listed may
affect device reliability or cause permanent damage to the device.
CAUTION: All inputs that tolerate 5 V cannot be more than 2.5 V greater than the supply voltage. This restriction
applies to power-up and normal operation (that is, if the MPC850 is unpowered, voltage greater than 2.5 V must not
be applied to its inputs).
The MPC850, a high-frequency device in a BGA package, does not provide a guaranteed maximum ambient
temperature. Only maximum junction temperature is guaranteed. It is the responsibility of the user to consider power
dissipation and thermal management. Junction temperature ratings are the same regardless of frequency rating of
the device.
1
Rating
2
Freescale Semiconductor, Inc.
MPC850 (Rev. A/B/C) Hardware Specifications
For More Information On This Product,
Table 3-2. Maximum Ratings
Go to: www.freescale.com
VDDH
VDDL
KAPWR
VDDSYN
V
T
T
j
stg
in
Symbol
CC
). Table 4-3 provides the package thermal
-0.3 to 4.0
-0.3 to 4.0
-0.3 to 4.0
-0.3 to 4.0
GND-0.3 to VDDH + 2.5 V
0 to 95 (standard)
-40 to 95 (extended)
-55 to +150
Value
MOTOROLA
Unit
˚C
˚C
V
V
V
V
V

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