XPC850ZT50B Freescale Semiconductor, XPC850ZT50B Datasheet - Page 70
XPC850ZT50B
Manufacturer Part Number
XPC850ZT50B
Description
Manufacturer
Freescale Semiconductor
Datasheet
1.XPC850ZT50B.pdf
(76 pages)
Specifications of XPC850ZT50B
Family Name
MPC8xx
Device Core
PowerQUICC
Device Core Size
32b
Frequency (max)
50MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
3.3V
Operating Supply Voltage (max)
3.465V
Operating Supply Voltage (min)
3.135V
Operating Temp Range
0C to 95C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
256
Package Type
BGA
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XPC850ZT50B
Manufacturer:
SHARP
Quantity:
686
Part Number:
XPC850ZT50B
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
20 000
Part Number:
XPC850ZT50B-0K24A
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
20 000
Part Number:
XPC850ZT50BU
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
20 000
Pin Assignments and Mechanical Dimensions of the PBGA
Figure 9-64 shows the non-JEDEC package dimensions of the PBGA.
70
C
A1
A
SIDE VIEW
256X
Figure 9-64. Package Dimensions for the Plastic Ball Grid Array
SEATING
PLANE
A2
A3
0.35 C
0.20 C
4X
(E1)
0.20
4X
Freescale Semiconductor, Inc.
15X
MPC850 (Rev. A/B/C) Hardware Specifications
E
e /2
B
For More Information On This Product,
A
e
E2
(PBGA)—non-JEDEC Standard
BOTTOM VIEW
1
Go to: www.freescale.com
2
3
4
5
6
TOP VIEW
7 8 9 10 11 12 13 14 15
(D1)
D2
15X
D
256X
e
0.30
0.15
b
M
M
16
C A B
C
M
G
T
R
P
N
L
K
J
H
F
E
D
C
B
A
NOTES:
1.
2.
3.
4.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
DIMENSIONS IN MILLIMETERS.
DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO PRIMARY
DATUM C.
PRIMARY DATUM C AND THE SEATING PLANE ARE
DEFINED BY THE SPHERICAL CROWNS OF THE
SOLDER BALLS.
DIM
A1
A2
A3
D1
D2
E1
E2
A
D
E
b
e
19.00
19.00
MILLIMETERS
MIN
1.91
0.50
1.12
0.29
0.60
23.00 BSC
19.05 REF
23.00 BSC
19.05 REF
1.27 BSC
20.00
20.00
MAX
2.35
0.70
1.22
0.43
0.90
MOTOROLA