S29GL256M10TAIR10 Spansion Inc., S29GL256M10TAIR10 Datasheet - Page 116

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S29GL256M10TAIR10

Manufacturer Part Number
S29GL256M10TAIR10
Description
Manufacturer
Spansion Inc.
Datasheet

Specifications of S29GL256M10TAIR10

Cell Type
NOR
Density
256Mb
Access Time (max)
100ns
Interface Type
Parallel
Boot Type
Not Required
Address Bus
25/24Bit
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Program/erase Volt (typ)
3/11.5 to 12.5V
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
32M/16M
Supply Current
60mA
Mounting
Surface Mount
Pin Count
56
Lead Free Status / Rohs Status
Not Compliant
Revision B6 (October 10, 2006)
Revision B7 (January 22, 2007)
Revision B8 (February 7, 2007)
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary
industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for any use that
includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal
injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control,
medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and
artificial satellite). Please note that Spansion will not be liable to you and/or any third party for any claims or damages arising in connection with above-men-
tioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures
by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other
abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under
the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-
thorization by the respective government entity be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion product under development by
Spansion Inc. Spansion Inc. reserves the right to change or discontinue work on any product without notice. The information in this document is provided
as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement
of third-party rights, or any other warranty, express, implied, or statutory. Spansion Inc. assumes no liability for any damages of any kind arising out of the
use of the information in this document.
Copyright © 2004–2007 Spansion Inc. All rights reserved. Spansion, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations thereof, are trade-
marks of Spansion Inc. Other company and product names used in this publication are for identification purposes only and may be trademarks of their re-
spective companies.
114
Global
Deleted FBG048 package from S29GL032M device. Added “retired product” status text to cover
page, and first page and Ordering Information sections of data sheet.
AC Characteristics
Erase/Program Operations table, all devices: Changed t
Global
Updated retired product status text.
S29GL-M MirrorBit
D a t a
TM
Flash Family
S h e e t
BUSY
to a maximum specification.
S29GL-M_00_B8 February 7, 2007

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