S29GL256M10TAIR10 Spansion Inc., S29GL256M10TAIR10 Datasheet - Page 12

no-image

S29GL256M10TAIR10

Manufacturer Part Number
S29GL256M10TAIR10
Description
Manufacturer
Spansion Inc.
Datasheet

Specifications of S29GL256M10TAIR10

Cell Type
NOR
Density
256Mb
Access Time (max)
100ns
Interface Type
Parallel
Boot Type
Not Required
Address Bus
25/24Bit
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Program/erase Volt (typ)
3/11.5 to 12.5V
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
32M/16M
Supply Current
60mA
Mounting
Surface Mount
Pin Count
56
Lead Free Status / Rohs Status
Not Compliant
For S29GL064M (model R0) only
Special Package Handling Instructions
10
NC*
NC*
NC*
NC*
A8
A7
A1
A2
Special handling is required for Flash Memory products in molded packages (TSOP and BGA). The
package and/or data integrity may be compromised if the package body is exposed to tempera-
tures above 150°C for prolonged periods of time.
NC*
NC*
NC*
B8
B7
B1
RY/BY#
WE#
A14
C7
C6
C4
C2
A9
C5
C3
A7
A3
* Balls are shorted together via the substrate but not connected to the die.
RESET#
ACC
A13
A18
D7
D6
D4
D2
D5
D3
A8
A4
S29GL-M MirrorBit
Top View, Balls Facing Down
63-Ball Fine-Pitch BGA
A15
A11
A22
E7
E6
E4
NC
E2
E5
E3
A6
A2
A16
A12
NC
NC
F7
F6
F4
F2
F5
F3
A5
A1
D a t a
TM
DQ5
DQ2
DQ0
A17
A19
G7
G6
G4
G2
G5
G3
A0
Flash Family
S h e e t
DQ3
CE#
A10
H7
NC
H6
NC
H4
NC
H2
H5
H3
DQ6
OE#
V
A20
V
NC
J7
J6
J4
J2
J5
J3
CC
IO
DQ7
DQ4
DQ1
V
A21
V
K7
K6
K4
K2
K5
K3
SS
SS
NC*
NC*
NC*
NC*
L1
L8
L7
L2
S29GL-M_00_B8 February 7, 2007
NC*
NC*
NC*
NC*
M1
M8
M7
M2

Related parts for S29GL256M10TAIR10