ELANSC400-66AI AMD (ADVANCED MICRO DEVICES), ELANSC400-66AI Datasheet - Page 130

• Manufacturer Part Number: ELANSC400-66AI
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of ELANSC400-66AI

• Cpu Family: Elan
• Device Core Size: 16/32Bit
• Frequency (max): 66MHz
• Interface Type: ISA
• Program Memory Type: ROMLess
• Program Memory Size: Not Required
• Number Of Timers - General Purpose: 1
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 95C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 292
• Package Type: BGA
• Lead Free Status / Rohs Status: Not Compliant

THERMAL CHARACTERISTICS
The thermal specifications for the ÉlanSC400 and
ÉlanSC410 microcontrollers are given as a T
case temperature) specification. The 33-MHz and
66-MHz devices are specified for operation when
T
device is specified for operation when T
the range of 0°C–+85°C. T
any environment to determine whether the microcon-
troller is within specified operating range. The case
temperature should be measured at the center of the
top surface opposite the solder balls.
The ambient temperature (T
T
calculated from
equations:
T
T
T
130
A
CASE
CASE
J
CASE
= T
= T
Resistance
Thermal
CASE
J
is not violated. The ambient temperature can be
= T
is with the range of 0°C–+95°C. The 100-MHz
– P •
JA
J-T
A
+ P •
Maximum T
+ P • (
at 100 MHz
at 33 MHz
at 66 MHz
JA
Table 52. Thermal Resistance
J-T
JA
J-T
–
A
and
J-T
Élan™SC400 and ÉlanSC410 Microcontrollers Data Sheet
25.0
6.2
(0)
A
CASE
0
)
) is guaranteed as long as
JA
Table 53. Maximum T
can be measured in
from the following
CASE
83.7
72.0
50.8
(0)
0
CASE
(1.01)
20.5
200
is within
6.2
(the
J-T
Airflow in Feet/Minute (m/s)
and
A
at Various Airflows in °C
(1.01)
86.4
77.5
59.0
200
where:
T
T
T
(°C/W).
P is the maximum power consumption (W).
The values for
the BGA 292 package. These numbers are valid only
for packages with all 292 balls soldered to a board with
two power planes and two signal planes.
Table 53 shows the T
T
P is calculated using the I
DC Characteristics section beginning on page 86.
JA
A
JA
J
CASE
CASE
J-T
Airflow in Feet/Minute (m/s)
is the junction temperature (°C).
is the ambient temperature (°C).
(°C/W) for the 292-BGA Package)
is the junction-to-ambient thermal resistance
(2.03)
19.0
is the junction-to-case thermal resistance (°C/W).
400
6.2
) at various airflows and operating frequencies.
is the case temperature (°C).
(2.03)
87.3
79.3
61.7
400
JA
and
A
(3.04)
18.1
600
allowable (without exceeding
6.2
CC
J-T
at 3.3 V as tabulated in the
(3.04)
87.8
80.4
63.4
are given in Table 52 for
600
(4.06)
17.4
800
6.2
(4.06)
88.3
81.3
64.6
800