LPC1754FBD80,518 NXP Semiconductors, LPC1754FBD80,518 Datasheet - Page 38

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LPC1754FBD80,518

Manufacturer Part Number
LPC1754FBD80,518
Description
IC MCU 32BIT 128KB FLASH 80LQFP
Manufacturer
NXP Semiconductors
Series
LPC17xxr
Datasheet

Specifications of LPC1754FBD80,518

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
100MHz
Connectivity
CAN, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number Of I /o
52
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 3.6 V
Data Converters
A/D 6x12b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-LQFP
Package
80LQFP
Device Core
ARM Cortex M3
Family Name
LPC1700
Maximum Speed
100 MHz
Operating Supply Voltage
3.3 V
Data Bus Width
32 Bit
Number Of Programmable I/os
52
Interface Type
CAN/I2C/SPI/UART/USB
On-chip Adc
6-chx12-bit
Number Of Timers
4
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC1754FBD80,518
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Part Number:
LPC1754FBD80,518
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
9. Thermal characteristics
Table 5.
V
LPC1759_58_56_54_52_51
Product data sheet
Symbol
T
DD
j(max)
= 2.4 V to 3.6 V; T
Thermal characteristics
Parameter
maximum junction
temperature
9.1 Thermal characteristics
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
=
J
=
T
R
P
40
amb
D
th(j-a)
T
amb
= sum of internal and I/O power dissipation
C to +85
= ambient temperature (C),
= the package junction-to-ambient thermal resistance (C/W)
+
P
D
All information provided in this document is subject to legal disclaimers.
Conditions
C unless otherwise specified;
R
th j a
Rev. 7 — 29 March 2011
LPC1759/58/56/54/52/51
J
(C), can be calculated using the following
Min
-
DD
32-bit ARM Cortex-M3 microcontroller
and V
DD
Typ
-
. The I/O power dissipation of
Max
125
© NXP B.V. 2011. All rights reserved.
Unit
C
38 of 74
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