STM32F407IGT6 STMicroelectronics, STM32F407IGT6 Datasheet - Page 75

• Manufacturer Part Number: STM32F407IGT6
• Description: IC MCU 32BIT 1MB FLASH 176LQFP
• Manufacturer: STMicroelectronics

Specifications of STM32F407IGT6

• Core Processor: ARM Cortex-M4
• Core Size: 32-Bit
• Speed: 168MHz
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 140
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 192K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 24x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Core: ARM Cortex M4
• Processor Series: STM32F4
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 168 MHz
• Data Ram Size: 192 KB
• On-chip Adc: Yes
• Number Of Programmable I/os: 140
• Number Of Timers: 10
• Operating Supply Voltage: 1.7 V to 3.6 V
• Mounting Style: SMD/SMT
• A/d Bit Size: 12 bit
• A/d Channels Available: 24
• Interface Type: CAN, I2C, I2S, SPI, UART
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-11604

STM32F405xx, STM32F407xx
Table 27.
1. Resonator characteristics given by the crystal/ceramic resonator manufacturer.
2. Based on characterization, not tested in production.
3. The relatively low value of the RF resistor offers a good protection against issues resulting from use in a
4. t
For C
5 pF to 25 pF range (typ.), designed for high-frequency applications, and selected to match
the requirements of the crystal or resonator (see
same size. The crystal manufacturer typically specifies a load capacitance which is the
series combination of C
can be used as a rough estimate of the combined pin and board capacitance) when sizing
C
microcontrollers” available from the ST website www.st.com.
Figure 23. Typical application with an 8 MHz crystal
1. R
Low-speed external clock generated from a crystal/ceramic resonator
The low-speed external (LSE) clock can be supplied with a 32.768 kHz crystal/ceramic
resonator oscillator. All the information given in this paragraph are based on characterization
results obtained with typical external components specified in
the resonator and the load capacitors have to be placed as close as possible to the oscillator
pins in order to minimize output distortion and startup stabilization time. Refer to the crystal
resonator manufacturer for more details on the resonator characteristics (frequency,
package, accuracy).
t
SU(HSE
Symbol
L1
f
OSC_IN
humid environment, due to the induced leakage and the bias condition change. However, it is
recommended to take this point into account if the MCU is used in tough humidity conditions.
oscillation is reached. This value is measured for a standard crystal resonator and it can vary significantly
with the crystal manufacturer
SU(HSE)
R
g
and C
C
EXT
i
2
m
F
L1
Resonator with
integrated capacitors
(4)
value depends on the crystal characteristics.
and C
is the startup time measured from the moment it is enabled (by software) to a stabilized 8 MHz
L2
Oscillator frequency
Feedback resistor
Recommended load capacitance
versus equivalent serial
resistance of the crystal (R
HSE driving current
Oscillator transconductance
Startup time
. Refer to the application note AN2867 “Oscillator design guide for ST
HSE 4-26 MHz oscillator characteristics
L2
, it is recommended to use high-quality external ceramic capacitors in the
C L2
C L1
Parameter
L1
and C
8 MH z
resonator
R
EXT
Doc ID 022152 Rev 1
(1)
L2
. PCB and MCU pin capacitance must be included (10 pF
S
)
(3)
OSC_OU T
OSC_IN
V
DD
V
R F
with 30 pF load
= 3.3 V, V
DD
Conditions
R
Figure
Startup
S
is stabilized
controlled
= 30 Ω
Bias
gain
(1) (2)
IN
23). C
= V
SS
Table
L1
STM32F
Electrical characteristics
and C
Min
4
5
-
-
-
-
28. In the application,
f HSE
L2
Typ
200
15
2
are usually the
-
-
-
Max
26
1
-
-
-
-
ai17530
mA/V
75/154
MHz
Unit
mA
ms
kΩ
pF