C8051F700-GQR Silicon Laboratories Inc, C8051F700-GQR Datasheet - Page 40

• Manufacturer Part Number: C8051F700-GQR
• Description: MCU 8-Bit C8051F70x 8051 CISC 15KB Flash 1.8V/3V 64-Pin TQFP T/R
• Manufacturer: Silicon Laboratories Inc

Specifications of C8051F700-GQR

• Package: 64TQFP
• Device Core: 8051
• Family Name: C8051F70x
• Maximum Speed: 25 MHz
• Ram Size: 512 Byte
• Program Memory Size: 15 KB
• Operating Supply Voltage: 1.8|3 V
• Data Bus Width: 8 Bit
• Program Memory Type: Flash
• Number Of Programmable I/os: 54
• Interface Type: I2C/SMBus/SPI/UART
• On-chip Adc: 16-chx10-bit
• Operating Temperature: -40 to 85 °C
• Number Of Timers: 4

C8051F70x/71x
40
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all pads.
7. A No-Clean, Type-3 solder paste is recommended.
8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
pad is to be 60 m minimum, all the way around the pad.
solder paste release.
Components.
Dimension
C1
C2
X1
Y1
E
Table 5.2. TQFP-48 PCB Land Pattern Dimensions
Figure 5.2. TQFP-48 PCB Land Pattern
Rev. 1.0
8.30
8.30
0.20
1.40
Min
0.50 BSC
Max
8.40
8.40
0.30
1.50