SC16C2552IA44,518 NXP Semiconductors, SC16C2552IA44,518 Datasheet - Page 36
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
SC16C2552IA44,518
Manufacturer Part Number
SC16C2552IA44,518
Description
IC UART DUAL SOT187-2
Manufacturer
NXP Semiconductors
Datasheet
1.SC16C2552IA44529.pdf
(38 pages)
Specifications of SC16C2552IA44,518
Features
2 Channels
Number Of Channels
2, DUART
Fifo's
16 Byte
Voltage - Supply
2.5V, 3.3V, 5V
With False Start Bit Detection
Yes
With Modem Control
Yes
With Cmos
Yes
Mounting Type
Surface Mount
Package / Case
44-LCC (J-Lead)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935270026518
SC16C2552IA44-T
SC16C2552IA44-T
SC16C2552IA44-T
SC16C2552IA44-T
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SC16C2552IA44,518
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Philips Semiconductors
13. Revision history
Table 27:
9397 750 11636
Product data
Rev Date
03
02
01
20030620
20030313
20020910
Revision history
CPCN
-
-
-
[3]
[4]
[5]
[6]
[7]
Description
Product data (9397 750 11636). ECN 853-2375 30034 of 16 June 2003.
Modifications:
Product data (9397 750 11205). ECN 853-2375 29620 of 07 March 2003.
Product data (9397 750 08936). ECN 853-2375 28891 of 10 September 2002.
•
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 C
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Figure 3 “Crystal oscillator connection.” on page
added connection with oscillator.
Rev. 03 — 20 June 2003
Dual UART with 16-byte transmit and receive FIFOs
10 C measured in the atmosphere of the reflow
9: changed capacitors’ values and
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
SC16C2552
36 of 38