TDA8947J/N3,112 NXP Semiconductors, TDA8947J/N3,112 Datasheet

IC AMP AUDIO PWR 29W QUAD 17SIL

TDA8947J/N3,112

Manufacturer Part Number
TDA8947J/N3,112
Description
IC AMP AUDIO PWR 29W QUAD 17SIL
Manufacturer
NXP Semiconductors
Type
Class ABr
Datasheet

Specifications of TDA8947J/N3,112

Output Type
4-Channel (Quad)
Package / Case
17-SIL (Bent and Staggered Leads)
Max Output Power X Channels @ Load
29W x 2 @ 8 Ohm; 14W x 4 @ 4 Ohm
Voltage - Supply
9 V ~ 26 V
Features
Depop, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type
Through Hole
Product
Class-AB
Output Power
29 W
Available Set Gain
32 dB
Thd Plus Noise
0.05 %
Operating Supply Voltage
18 V
Maximum Power Dissipation
69000 mW
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
Audio Load Resistance
8 Ohms
Input Signal Type
Single
Minimum Operating Temperature
- 40 C
Output Signal Type
Differential, Single
Supply Type
Single
Supply Voltage (max)
26 V
Supply Voltage (min)
9 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-3458-5
935274472112
TDA8947J
1. General description
2. Features
3. Applications
The TDA8947J contains four identical audio power amplifiers. The TDA8947J can be used
as: four Single-Ended (SE) channels with a fixed gain of 26 dB, two times Bridge-Tied
Load (BTL) channels with a fixed gain of 32 dB or two times SE channels (26 dB gain)
plus one BTL channel (32 dB gain) operating as a 2.1 system
The TDA8947J comes in a 17-pin Dil-Bent-Sil (DBS) power package. The TDA8947J is
pin compatible with the TDA8944AJ and TDA8946AJ.
The TDA8947J contains a unique protection circuit that is solely based on multiple
temperature measurements inside the chip. This gives maximum output power for all
supply voltages and load conditions with no unnecessary audio holes. Almost any supply
voltage and load impedance combination can be made as long as thermal boundary
conditions (number of channels used, external heatsink and ambient temperature)
allow it.
TDA8947J
4-channel audio amplifier
Rev. 02 — 16 June 2005
SE: 1 W to 25 W, BTL: 4 W to 50 W operation possibility (2.1 system)
Soft clipping
Standby and Mute mode
No on/off switching plops
Low standby current
High supply voltage ripple rejection
Outputs short-circuit protected to ground, supply and across the load
Thermally protected
Pin compatible with TDA8944AJ and TDA8946AJ
Television
PC speakers
Boom box
Mini and micro audio receivers
Product data sheet

Related parts for TDA8947J/N3,112

TDA8947J/N3,112 Summary of contents

Page 1

TDA8947J 4-channel audio amplifier Rev. 02 — 16 June 2005 1. General description The TDA8947J contains four identical audio power amplifiers. The TDA8947J can be used as: four Single-Ended (SE) channels with a fixed gain of 26 dB, two times ...

Page 2

Philips Semiconductors 4. Quick reference data Table 1: Symbol stb P o(SE) P o(BTL) THD G v(max) SVRR [1] The amplifier can deliver output power with non clipping output signals into nominal loads as long ...

Page 3

Philips Semiconductors 6. Block diagram Fig 1. Block diagram 9397 750 14938 Product data sheet V V CC1 3 8 IN1 IN2 IN3 IN4 CIV ...

Page 4

Philips Semiconductors 7. Pinning information 7.1 Pinning Fig 2. Pin configuration 7.2 Pin description Table 3: Symbol OUT1+ GND1 V CC1 OUT2 MODE2 IN2+ SGND IN1+ IN3+ MODE1 SVR IN4+ CIV OUT3 GND2 9397 750 14938 Product data sheet OUT1 ...

Page 5

Philips Semiconductors Table 3: Symbol V CC2 OUT4+ TAB 8. Functional description 8.1 Input configuration The input cut-off frequency is cut off – For SE application cut off – For BTL application ...

Page 6

Philips Semiconductors 8.2.1 Output power measurement The output power as a function of the supply voltage is measured on the output pins at THD = 10 %; see The maximum output power is limited by the supply voltage (V maximum ...

Page 7

Philips Semiconductors On — The amplifier is operating normally. The On mode is activated at V MODE1 The output channels 3 and 4 can be switched on/off by applying a proper DC voltage to pin MODE2, under the condition that ...

Page 8

Philips Semiconductors 8.5 Built-in protection circuits The TDA8947J contains two types of detection sensors: one measures local temperatures of the power stages and one measures the global chip temperature local temperature of approximately 185 global ...

Page 9

Philips Semiconductors 11. Static characteristics Table 8: Static characteristics amb L otherwise specified. Symbol Parameter Supply V supply voltage CC I quiescent supply current q I ...

Page 10

Philips Semiconductors Table 9: Dynamic characteristics kHz amb L otherwise specified. Symbol Parameter V noise output voltage n(o) SVRR supply voltage ripple ...

Page 11

Philips Semiconductors BTL mV Fig 4. AC output voltage as function of voltage on pin MODE1 ( THD ...

Page 12

Philips Semiconductors 2 10 THD N (%) kHz Fig 6. Total harmonic distortion-plus-noise as function of ...

Page 13

Philips Semiconductors ( THD = kHz Fig 8. Output power as function of supply voltage 20 P ...

Page 14

Philips Semiconductors 0 cs (dB 100 Fig 10. Channel separation as function of frequency (no bandpass filter applied) 0 ...

Page 15

Philips Semiconductors 13. Application information 13.1 Application diagrams 100 270 BC547 7.5 V 2.2 F micro- BC547 controller 1.5 k Fig 12. Typical application diagram without on/off switching plops Table 11: Microcontroller with ...

Page 16

Philips Semiconductors 220 220 470 MODE1 MICRO- CONTROLLER MODE2 Fig 13. Application diagram with one pin control and reduction of capacitor Remark: Because of switching inductive ...

Page 17

Philips Semiconductors 13.2 Printed-circuit board 13.2.1 Layout and grounding To obtain a high-level system performance, certain grounding techniques are essential. The input reference grounds have to be tied with their respective source grounds and must have separate tracks from the ...

Page 18

Philips Semiconductors 13.3 Thermal behavior and heatsink calculation The measured maximum thermal resistance of the IC package calculation for the heatsink can be made, with the following parameters: T amb(max and ...

Page 19

Philips Semiconductors 150 T j (˚C ) (1) (2) (3) 100 external heatsink of 5 K/W. amb ( ( (3) R ...

Page 20

Philips Semiconductors 15. Package outline DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm DIMENSIONS (mm are the original dimensions) UNIT 17.0 4.6 0.75 0.48 24.0 mm 15.5 4.4 ...

Page 21

Philips Semiconductors 16. Soldering 16.1 Introduction to soldering through-hole mount packages This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit ...

Page 22

Philips Semiconductors 17. Revision history Table 13: Revision history Document ID Release date TDA8947J_2 20050616 • Modifications: The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. TDA8947J-01 20040206 ...

Page 23

Philips Semiconductors 18. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...

Page 24

Philips Semiconductors 23. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

Related keywords