TDA8947J/N3,112 NXP Semiconductors, TDA8947J/N3,112 Datasheet - Page 21

• Manufacturer Part Number: TDA8947J/N3,112
• Description: IC AMP AUDIO PWR 29W QUAD 17SIL
• Manufacturer: NXP Semiconductors
• Type: Class ABr

Specifications of TDA8947J/N3,112

• Output Type: 4-Channel (Quad)
• Package / Case: 17-SIL (Bent and Staggered Leads)
• Max Output Power X Channels @ Load: 29W x 2 @ 8 Ohm; 14W x 4 @ 4 Ohm
• Voltage - Supply: 9 V ~ 26 V
• Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
• Mounting Type: Through Hole
• Product: Class-AB
• Output Power: 29 W
• Available Set Gain: 32 dB
• Thd Plus Noise: 0.05 %
• Operating Supply Voltage: 18 V
• Maximum Power Dissipation: 69000 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Audio Load Resistance: 8 Ohms
• Input Signal Type: Single
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Differential, Single
• Supply Type: Single
• Supply Voltage (max): 26 V
• Supply Voltage (min): 9 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-3458-5; 935274472112; TDA8947J

Philips Semiconductors
16. Soldering
9397 750 14938
Product data sheet
16.1 Introduction to soldering through-hole mount packages
16.2 Soldering by dipping or by solder wave
16.3 Manual soldering
16.4 Package related soldering information
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 C and 400 C, contact may be up to 5 seconds.
Table 12:
[1]
[2]
Package
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
For PMFP packages hot bar soldering or manual soldering is suitable.
[2]
Suitability of through-hole mount IC packages for dipping and wave soldering
methods
Rev. 02 — 16 June 2005
Soldering method
Dipping
-
suitable
-
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
4-channel audio amplifier
Wave
suitable
suitable
not suitable
TDA8947J
stg(max)
[1]
). If the
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