AD7858 Analog Devices, AD7858 Datasheet - Page 6

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AD7858

Manufacturer Part Number
AD7858
Description
3 V to 5 V Single Supply, 200 kSPS, 8-Channel, 12-Bit, Serial Sampling ADC
Manufacturer
Analog Devices
Datasheet

Specifications of AD7858

Resolution (bits)
12bit
# Chan
8
Sample Rate
200kSPS
Interface
Ser,SPI
Analog Input Type
SE-Uni
Ain Range
(Vref) p-p,Uni (Vref)
Adc Architecture
SAR
Pkg Type
DIP,SOIC

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CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD7858/AD7858L features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions
are recommended to avoid performance degradation or loss of functionality.
AD7858/AD7858L
Model
AD7858AN
AD7858BN
AD7858LAN
AD7858LBN
AD7858AR
AD7858BR
AD7858LAR
AD7858LBR
AD7858LARS
EVAL-AD7858CB
EVAL-CONTROL BOARD
NOTES
1
2
3
4
5
ABSOLUTE MAXIMUM RATINGS
(T
AV
DV
AV
Analog Input Voltage to AGND . . . . –0.3 V to AV
Digital Input Voltage to DGND . . . . –0.3 V to DV
Digital Output Voltage to DGND . . . –0.3 V to DV
REF
Input Current to Any Pin Except Supplies
Operating Temperature Range
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW
Linearity error here refers to integral linearity error.
N = Plastic DIP; R = SOIC; RS = SSOP.
L signifies the low-power version.
This can be used as a stand-alone evaluation board or in conjunction with the EVAL-
This board is a complete unit allowing a PC to control and communicate with all
CONTROL BOARD for evaluation/demonstration purposes.
Analog Devices evaluation boards ending in the CB designators.
Commercial (A, B Versions) . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . –65°C to +150°C
θ
θ
Lead Temperature, (Soldering, 10 sec) . . . . . . . . . . +260°C
A
DD
DD
DD
JA
JC
= +25°C unless otherwise noted)
IN
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105°C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 34.7°C/W
to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
to DV
/REF
to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
OUT
DD
3
3
3
3
3
to AGND . . . . . . . . . –0.3 V to AV
. . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
4
ORDERING GUIDE
5
Linearity Power
Error
(LSB)
± 1
± 1/2
± 1
± 1
± 1
± 1/2
± 1
± 1
± 1
1
1
2
Dissipation Package
(mW)
20
20
6.85
6.85
20
20
6.85
6.85
6.85
. . . . . . . ± 10 mA
DD
DD
DD
DD
Options
N-24
N-24
N-24
N-24
R-24
R-24
R-24
R-24
RS-24
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
2
SOIC, SSOP Package, Power Dissipation . . . . . . . . . . 450 mW
NOTES
1
2
Stresses above those listed under Absolute Maximum Ratings may cause perma-
Transient currents of up to 100 mA will not cause SCR latch-up.
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
θ
θ
Lead Temperature, Soldering
JA
JC
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
Thermal Impedance . . . 75°C/W (SOIC) 115°C/W (SSOP)
Thermal Impedance . . . . 25°C/W (SOIC) 35°C/W (SSOP)
REF
IN
CONVST
/REF
PIN CONFIGURATIONS
SLEEP
DIP, SOIC, AND SSOP
AGND
C
C
BUSY
AV
AIN1
AIN2
AIN3
AIN4
REF1
REF2
OUT
DD
10
11
12
1
2
3
4
5
6
7
8
9
(Not to Scale)
AD7858L
TOP VIEW
AD7858/
WARNING!
19
18
17
16
15
14
13
24
23
22
21
20
SYNC
SCLK
CLKIN
DIN
DOUT
DGND
DV
CAL
AIN8
AIN7
AIN6
AIN5
DD
ESD SENSITIVE DEVICE

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