ST72361J6 STMicroelectronics, ST72361J6 Datasheet - Page 209

• Manufacturer Part Number: ST72361J6
• Description: 8-bit MCU
• Manufacturer: STMicroelectronics

Specifications of ST72361J6

• Hdflash Endurance: 100 cycles, data retention 40 years at 85°C
• 5 Power Saving Modes: Halt, Auto Wake Up From Halt, Active Halt, Wait and Slow

Figure 126. 32-Pin Low Profile Quad Flat Package (7x7)
13.2 THERMAL CHARACTERISTICS
Notes:
1. The maximum power dissipation is obtained from the formula P
cation can be defined by the user with the formula: P
and P
2. The maximum chip-junction temperature is based on technology characteristics.
13.3 SOLDERING AND GLUEABILITY INFORMATION
In order to meet environmental requirements, ST
offers these devices in ECOPACK® packages.
These packages have a lead-free second level in-
terconnect. The category of second level intercon-
nect is marked on the package and on the inner
box label, in compliance with JEDEC Standard
PORT
Symbol
T
R
Jmax
P
is the port power dissipation depending on the ports used in the application.
thJA
D
D1
D
Package thermal resistance (junction to ambient)
Power dissipation
Maximum junction temperature
E1
E
1)
Ratings
D
= P
L1
2)
INT
e
b
L
A1
+ P
JESD97. The maximum ratings related to solder-
ing conditions are also marked on the inner box la-
bel.
ECOPACK is an ST trademark. ECOPACK®
specifications are available at www.st.com.
PORT
D
A2
A
= (T
h
c
where P
J
LQFP64
LQFP44
LQFP32
- T
Note 1. Values in inches are converted from mm
and rounded to 4 decimal digits.
Dim.
A
A1
A2
D1
E1
L1
A
C
D
N
b
E
e
L
θ
) / R
INT
thJA
0.05
1.35 1.40 1.45 0.0531 0.0551 0.0571
0.30 0.37 0.45 0.0118 0.0146 0.0177
0.09
0.45 0.60 0.75 0.0177 0.0236 0.0295
Min
0°
is the chip internal power (I
. The power dissipation of an appli-
9.00
7.00
9.00
7.00
0.80
1.00
mm
Typ
3.5°
Value
Number of Pins
Max
1.60
0.15 0.0020
0.20 0.0035
150
500
60
52
70
7°
32
Min
0°
inches
0.3543
0.2756
0.3543
0.2756
0.0315
0.0394
Typ
3.5°
ST72361
DD
1)
°C/W
Unit
mW
209/225
0.0059
°C
0.0630
0.0079
x V
Max
7°
DD
)