STPCC03 STMicroelectronics, STPCC03 Datasheet - Page 40

• Manufacturer Part Number: STPCC03
• Description: STPC CONSUMER-S DATASHEET- PC COMPATIBLE EMBEDDED MICROPROCESSOR
• Manufacturer: STMicroelectronics

MECHANICAL DATA
5.2 388-Pin Package thermal data
388-pin PBGA package has a Power Dissipation
Capability of 4.5W which increases to 6W when
used with a Heatsink.
40/59
Figure 5-4. 388-Pin PBGA structure
Figure 5-5. Thermal dissipation without heatsink
Board
Signal layers
Ambient
Case
Junction
Board
Ambient
Rca
Rjc
Rjb
Rba
Board
Issue 1.1 - October 16, 2000
8.5
Rja = 13 C/W
6
Junction
Ambient
Thermal balls
6
125
Case
Structure in shown in Figure 5-4.
Thermal dissipation options are illustrated inFig-
ure 5-5 and Figure 5-6.
Board dimensions:
- 10.2 cm x 12.7 cm
- 4 layers (2 for signals, 1 GND, 1VCC)
The PBGA is centered on board
There are no other devices
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Copper thickness:
- 17 m for internal layers
- 34 m for external layers
Airflow = 0
Board temperature taken at the center balls
Power & Ground layers