MCC501RX166TD0B Motorola / Freescale Semiconductor, MCC501RX166TD0B Datasheet - Page 91

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MCC501RX166TD0B

Manufacturer Part Number
MCC501RX166TD0B
Description
Network Processor, 16 Processing Elements, 166MHz Core Operating Frequency, 5Gbps Max Throughput, 838-CBGA
Manufacturer
Motorola / Freescale Semiconductor
Datasheet
C-Port Confidential
Package
Measurements
Marking Codes
Reflow
Table 55
maximum sizes where appropriate.
Table 55 Package Measurements (Reference
Table 56
Table 56 C-5 Network Processor Marking Codes
Typical Reflow Profile for the C-5 Switch Module
1 Follow the guidelines recommended by your solder paste supplier.
Flux requrements must be met for best solderability.
2 The temperature profile should be carefully characterized to ensure uniform
Symbol
A
A
A
A
A
D
D
E
E
e
b
Marking (Explanation of Codes)
Top
Bottom
Pin 1 Marking
1
1
2
3
4
1
temperature across the board and package.
defines the C-5 NP package measurements, providing nominal, minimum, and
explains the marking on the C-5 NP.
Definition
Overall
Ball height
C4 and Die
Body thickness
Lid thickness
Body size
Ball footprint (X)
Body size
Ball footprint (Y)
Ball pitch
Ball diameter
Logo/Part#/Country of Origin/Date Code
N/A
Chamfered Corner
Nom. (mm) Min. (mm) Max. (mm)
5.63
0.89
0.88
2.26
1.6
37.50
35.56
37.50
35.56
1.27
0.89
Figure 26
and
5.31
2.07
Figure 27
Package Measurements
Preliminary Version — January 21, 2002
for Symbols)
5.95
2.53
91

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