S1D12200 Epson Electronics America, Inc., S1D12200 Datasheet - Page 108

• Manufacturer Part Number: S1D12200
• Description: S1d12000 Series Lcd Driver Ic Technical Manual Technical Manual
• Manufacturer: Epson Electronics America, Inc.

S1D12300 Series
4. PAD
Pad layout
1) A1 pad specification (S1D123
2) Au bump specification (S1D123
174
193
4–4
For reference:
173
1
S1D12300D
S1D12301D
S1D12302D
S1D12303D
Chip size:
Pad pitch:
Chip thickness:
Pad size:
Bump size A 80 m
Bump height
#1 Column for CG ROM pattern change
A 86 m
B 135 m
B 129 m
****
****
****
****
22.5 m
**
10.23 3.11 mm
110 m (Min.)
625 (S1D123
525 (S1D123
**
D
1/30 duty
1/23 duty
1/16 duty
1/16 duty
135 m
129 m
**
D
86 m
80 m
**
A
*
B
*
)
**
**
)
D
D
EPSON
**
**
12 columns + 1 signal column
12 columns + 1 signal column
12 columns + 1 signal column
16 columns
A
C
(0,0)
*
*
, S1D123
, S1D123
**
**
D
D
**
**
E
B
*
*
)
)
Rev. 1.9
58
86
85
69