S1D12200 Epson Electronics America, Inc., S1D12200 Datasheet - Page 65

• Manufacturer Part Number: S1D12200
• Description: S1d12000 Series Lcd Driver Ic Technical Manual Technical Manual
• Manufacturer: Epson Electronics America, Inc.

4. PIN LAYOUT
Rev. 1.1
S1D12205D
Chip size:
Pad pitch:
Chip thickness (Reference): 625 m
Au bump specifications
Bump size:
Bump height (Reference): 22.5 m
155
171
CGROM pattern version number
****
154
Pad Nos. 59 to 72, and 155 to 171: 78 m 59 m
Pad Nos. 1 to 58, and 73 to 154:
1
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.85
90 m (min)
. .
1.97 mm
EPSON
(0,0)
Top View
. . . . . . . . . . . . . . . . . . . .
Y
59 m 78 m
X
: Dummy PAD
: PAD
73
58
S1D12205 Series
72
59
3–3