S1D12200 Epson Electronics America, Inc., S1D12200 Datasheet - Page 191

• Manufacturer Part Number: S1D12200
• Description: S1d12000 Series Lcd Driver Ic Technical Manual Technical Manual
• Manufacturer: Epson Electronics America, Inc.

4. PAD
Pad Layout
Au bump specifications
Rev. 2.1
Note: The board of this IC has V
186
210
Bump size A TYPE
Bump height (reference value)
1
S1D124
board to the V
Chip size:
Pad pitch:
Chip thickness (reference value): 625
185
2
B TYPE
C TYPE
D TYPE
(For bump types, refer to the pad coordinate diagram.)
*******
3
4
Digits for CGROM pattern change
Number of display line
DD
00: 4-line display
01: 3-line display
02: 2-line display
5
potential at the time of mounting.
6
. . . . . . . . . . . . . . . . . . . . . . . .
DD
. . . . . . . . . . . . . . . . . . . . . . . .
potential. It is recommended to stabilize power supply by connecting the
60.0 m
81.5 m
85.0 m
60.0 m
22.5 m
8.70
90 m (Min.)
S1D12400 Series
2.80 mm
50 m (S1D124
EPSON
81.5 m
60.0 m
85.0 m
85.0 m
(0, 0)
5.5 m
Y
X
**
D
****
Die No.
D124
: DUMMY PAD
: PAD
)
*
D **
S1D12400 Series
101
74
100
75
6–3