AMIS-30521 AMI Semiconductor, Inc., AMIS-30521 Datasheet - Page 3

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AMIS-30521

Manufacturer Part Number
AMIS-30521
Description
Micro-stepping Motor Driver
Manufacturer
AMI Semiconductor, Inc.
Datasheet
AMIS-30521 Micro-stepping Motor Driver
5.1 Package Thermal Characteristics
The NQFP is designed to provide superior thermal performance, and using an exposed die pad on the bottom surface of the package
partly contributes to this. In order to take full advantage of this thermal performance, the PCB must have features to conduct heat away
from the package. A thermal grounded pad with thermal vias can achieve this. With a layout as shown in
Layout Condition, the thermal resistance junction – to – ambient can be brought down to a level of 30°C/W.
AMI Semiconductor – June 2007, M-20683-001
www.amis.com
GND
ERR
CLK
NXT
SLA
DIR
DI
Figure 3: PCB Ground Plane Layout Condition
1
2
3
4
5
6
7
8
Figure 2: Pin Out AMIS-30521
32
9
31
AMIS-30521
10
30
NQFP-32
11
12
29
3
13
28
14
27
26
15
25
16
24
23
22
21
20
19
18
17
PC20070309.2
GND
GND
MOTXN
MOTXN
MOTYN
MOTYN
GND
GND
PC20041128.2
Figure 3:
PCB Ground Plane
Data Sheet

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