DSPIC30F6012A Microchip Technology Inc., DSPIC30F6012A Datasheet - Page 219
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DSPIC30F6012A
Manufacturer Part Number
DSPIC30F6012A
Description
Dspic30f6011a/6012a/6013a/6014a High-performance Digital Signal Controllers
Manufacturer
Microchip Technology Inc.
Datasheet
1.DSPIC30F6012A.pdf
(238 pages)
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64-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
© 2006 Microchip Technology Inc.
Note:
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
JEDEC Equivalent: MS-026
Drawing No. C04-066
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
See ASME Y14.5M
p
c
dsPIC30F6011A/6012A/6013A/6014A
Dimension Limits
#leads = n1
E1
E
Units
(F)
D1
n1
A2
A1
E1
n
p
A
L
E
D
B
c
MIN
n
.037
.002
.018
.004
.012
Preliminary
11
11
0
2
1
.630 BSC
.630 BSC
.551 BSC
.551 BSC
.039 REF
.031 BSC
INCHES
D1
L
NOM
64
16
D
.039
.024
.015
3.5
12
12
A
A1
MAX
.047
.041
.006
.030
.008
.018
(F)
13
13
7
MIN
0.95
0.05
0.45
0.09
0.30
11
11
0
MILLIMETERS*
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
1.00 REF
Revised 7-20-06
0.80 BSC
NOM
64
16
1.00
0.60
0.37
3.5
12
12
DS70143C-page 217
A2
MAX
1.20
1.05
0.15
0.75
0.20
0.45
13
13
7