DSPIC30F6015 Microchip Technology Inc., DSPIC30F6015 Datasheet - Page 220

• Manufacturer Part Number: DSPIC30F6015
• Description: High-performance, 16-bit Digital Signal Controllers
• Manufacturer: Microchip Technology Inc.

dsPIC30F6010A/6015
80-Lead Plastic Thin Quad Flatpack (PF) – 14x14x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS70150C-page 218
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
b
e
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
N
β
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
1 2 3
D
D1
Dimension Limits
φ
L
Units
NOTE 2
A2
A1
D1
L1
E1
N
A
E
D
α
E1
e
L
φ
c
b
β
A
A1
E
0.95
0.05
0.45
0.09
0.22
MIN
11°
11°
0°
–
L1
MILLIMETERS
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
0.65 BSC
1.00 REF
NOM
1.00
0.60
0.32
3.5°
12°
12°
80
–
–
–
Microchip Technology Drawing C04-116B
© 2007 Microchip Technology Inc.
MAX
1.20
1.05
0.15
0.75
0.20
0.38
13°
13°
7°
A2
α