LTC2617 Linear Technology Corporation, LTC2617 Datasheet - Page 19

• Manufacturer Part Number: LTC2617
• Description: Ltc2617 - 14-bit Dual Rail-to-rail With I2c Interface
• Manufacturer: Linear Technology Corporation

PACKAGE DESCRIPTIO
3.50 ±0.05
2.20 ±0.05
TOP MARK
1.70 ±0.05
(2 SIDES)
(NOTE 6)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1
0.200 REF
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
0.25 ± 0.05
U
4.00 ±0.10
3.30 ±0.05
(2 SIDES)
(2 SIDES)
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695)
0.50
BSC
DE/UE Package
0.65 ±0.05
3.00 ±0.10
0.75 ±0.05
(2 SIDES)
PACKAGE OUTLINE
0.00 – 0.05
R = 0.20
1.70 ± 0.10
LTC2607/LTC2617/LTC2627
(2 SIDES)
TYP
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
7
6
R = 0.115
3.30 ±0.10
(2 SIDES)
TYP
0.50
BSC
12
1
0.38 ± 0.10
(UE12) DFN 0603
PIN 1
NOTCH
19
26071727f