CLIENT ST Microelectronics, Inc., CLIENT Datasheet - Page 50

• Manufacturer Part Number: CLIENT
• Description: STPC Client Datasheet / PC Compatible Embeded Microprocessor
• Manufacturer: ST Microelectronics, Inc.

MECHANICAL DATA
5.2 388-Pin Package thermal data
388-pin PBGA package has a Power Dissipation
Capability of 4.5W which increases to 6W when
used with a Heatsink.
50/61
Figure 5-4. 388-Pin PBGA structure
Figure 5-5. Thermal dissipation without heatsink
Board
Signal layers
Ambient
Case
Junction
Board
Ambient
Rca
Rjc
Rjb
Rba
Board
Issue 2.2 - October 13, 2000
8.5
Rja = 13 °C/W
6
Junction
Ambient
Thermal balls
6
125
Case
Structure in shown in
Thermal dissipation options are illustrated in
ure 5-5
and
Board dimensions:
- 10.2 cm x 12.7 cm
- 4 layers (2 for signals, 1 GND, 1VCC)
The PBGA is centered on board
There are no other devices
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Copper thickness:
- 17µm for internal layers
- 34µm for external layers
Airflow = 0
Board temperature taken at the center balls
Figure
5-6.
Power & Ground layers
Figure
5-4.
Fig-